JPS5740574A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
JPS5740574A
JPS5740574A JP11587080A JP11587080A JPS5740574A JP S5740574 A JPS5740574 A JP S5740574A JP 11587080 A JP11587080 A JP 11587080A JP 11587080 A JP11587080 A JP 11587080A JP S5740574 A JPS5740574 A JP S5740574A
Authority
JP
Japan
Prior art keywords
molecular weight
weight distribution
component
adhesive composition
compounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11587080A
Other languages
Japanese (ja)
Other versions
JPS6026516B2 (en
Inventor
Yoshiaki Someya
Tetsuo Hayashi
Yoshiaki Hirayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Priority to JP11587080A priority Critical patent/JPS6026516B2/en
Publication of JPS5740574A publication Critical patent/JPS5740574A/en
Publication of JPS6026516B2 publication Critical patent/JPS6026516B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To prepare an adhesive composition having excellent tensile shear strength, peeling strength and high-temperature adhesivity, and useful as a structural adhesive, by compounding an imidazole compound to an epoxy resin and a polyamide amine each having board molecular weight distribution.
CONSTITUTION: The objective composition is prepared by compounding (A) an epoxy resin (e.g. bisphenol A-epichlorohydrin resin) having a molecular weight distribution index of ≥1.2, (B) a polyamide amine (condensation product of a dimer acid and a polyamine) having molecular weight distribution index of ≥1.2, and (C) an imidazole compound (e.g. 2-methylimidazole). The ratio of the active amine hydrogen in the component (B) to the epoxy group in the component (A) is selected to 0.5W0.8. The adhesive composition is first cured at normal temperature, and then heated at pref. 60W100°C to effect the post-curing by the action of the component (C) and increase the bonding stregth.
COPYRIGHT: (C)1982,JPO&Japio
JP11587080A 1980-08-25 1980-08-25 adhesive composition Expired JPS6026516B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11587080A JPS6026516B2 (en) 1980-08-25 1980-08-25 adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11587080A JPS6026516B2 (en) 1980-08-25 1980-08-25 adhesive composition

Publications (2)

Publication Number Publication Date
JPS5740574A true JPS5740574A (en) 1982-03-06
JPS6026516B2 JPS6026516B2 (en) 1985-06-24

Family

ID=14673188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11587080A Expired JPS6026516B2 (en) 1980-08-25 1980-08-25 adhesive composition

Country Status (1)

Country Link
JP (1) JPS6026516B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989008683A1 (en) * 1988-03-14 1989-09-21 Lucky, Ltd. Thermoplastic resin composition
JPH02233716A (en) * 1989-03-07 1990-09-17 Nissan Motor Co Ltd Epoxy resin curable composition for structure
GB2518270A (en) * 2013-07-15 2015-03-18 Gen Electric Co Plc Coating, coated turbine component, and coating process
JP2020122086A (en) * 2019-01-31 2020-08-13 アイカ工業株式会社 Epoxy resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989008683A1 (en) * 1988-03-14 1989-09-21 Lucky, Ltd. Thermoplastic resin composition
JPH02233716A (en) * 1989-03-07 1990-09-17 Nissan Motor Co Ltd Epoxy resin curable composition for structure
GB2518270A (en) * 2013-07-15 2015-03-18 Gen Electric Co Plc Coating, coated turbine component, and coating process
GB2518270B (en) * 2013-07-15 2015-11-25 Gen Electric Co Plc Epoxy based coating and use thereof in coating a turbine component, and coating process
JP2020122086A (en) * 2019-01-31 2020-08-13 アイカ工業株式会社 Epoxy resin composition

Also Published As

Publication number Publication date
JPS6026516B2 (en) 1985-06-24

Similar Documents

Publication Publication Date Title
GB1499098A (en) Curable resin compositions
KR860001167A (en) Solvent-free polyimide-modified epoxy compositions
DE69926790D1 (en) POLYOXAZOLIDONE ADHESIVE COMPOSITION MADE FROM POLYEPOXIDES AND POLYISOCYANATES
EP0767189A3 (en) Epoxy coatings cured with diamines containing primary and tertiairy amine groups
JPS5740574A (en) Adhesive composition
JPS5723620A (en) Thermosetting resin composition
JPS56141310A (en) Curable resin composition
JPS5426000A (en) Epoxy resin composition
JPS52139199A (en) Novel epoxy resin compositions
ATE35685T1 (en) HEAT CURING EPOXY RESIN COMPOSITIONS.
JPS5659837A (en) Epoxy resin composition
KR920021647A (en) Curable epoxy resin composition comprising latent curing agents, amines and dithiols
JPS5679170A (en) Adhesive composition
JPS56157425A (en) Curable resin composition
JPS56157454A (en) Curable resin composition
EP0362787A3 (en) Modified amino curing agents for epoxy resins
JPS55155031A (en) Prepreg
JPS57167370A (en) Adhesive composition
JPS55147524A (en) Epoxy resin composition for prepreg
JPS572328A (en) Composition for adhesive
JPS5599981A (en) Adhesive composition
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS5620025A (en) Curing agent for epoxy resin
JPS5647445A (en) Epoxy resin composition
JPS56157452A (en) Curable resin composition