JPS5736302B2 - - Google Patents

Info

Publication number
JPS5736302B2
JPS5736302B2 JP9078880A JP9078880A JPS5736302B2 JP S5736302 B2 JPS5736302 B2 JP S5736302B2 JP 9078880 A JP9078880 A JP 9078880A JP 9078880 A JP9078880 A JP 9078880A JP S5736302 B2 JPS5736302 B2 JP S5736302B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9078880A
Other versions
JPS5628264A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5628264A publication Critical patent/JPS5628264A/ja
Publication of JPS5736302B2 publication Critical patent/JPS5736302B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Lubricants (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Organic Insulating Materials (AREA)
JP9078880A 1979-08-16 1980-07-04 Thixotropic heat conductive material Granted JPS5628264A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/067,481 US4265775A (en) 1979-08-16 1979-08-16 Non-bleeding thixotropic thermally conductive material

Publications (2)

Publication Number Publication Date
JPS5628264A JPS5628264A (en) 1981-03-19
JPS5736302B2 true JPS5736302B2 (ja) 1982-08-03

Family

ID=22076280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9078880A Granted JPS5628264A (en) 1979-08-16 1980-07-04 Thixotropic heat conductive material

Country Status (4)

Country Link
US (1) US4265775A (ja)
EP (1) EP0024498B1 (ja)
JP (1) JPS5628264A (ja)
DE (1) DE3061149D1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0896031A3 (en) * 1997-08-06 2000-01-26 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
US6632780B2 (en) 2001-01-04 2003-10-14 Hitachi, Ltd. Highly thermal conductive grease composition and cooling device using the same
JP2007177921A (ja) * 2005-12-28 2007-07-12 Nsk Ltd ボールねじ装置
WO2020162460A1 (ja) 2019-02-07 2020-08-13 信越化学工業株式会社 熱伝導性粘着層を有する熱伝導性シリコーンゴムシート

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4448840A (en) * 1982-06-14 1984-05-15 Toray Silicone Company, Ltd. Method for manufacturing a rubber sheet which is electrically insulating and thermally radiating and rubber sheets made therefrom with improve resistance to flexural fatigue
JPS58219034A (ja) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd 電気絶縁性放熱ゴムシ−トの製造方法
EP0114000B1 (en) * 1983-01-11 1986-10-01 Ferranti plc Thermally conducting filler for enclosing electrical components
US4701016A (en) * 1985-01-31 1987-10-20 American Telephone And Telegraph Company, At&T Bell Laboratories Thixotropic grease composition and cable comprising same
DE3525301A1 (de) * 1985-07-16 1987-01-22 Egbert Dr Brandau Reaktionsharz
US4803100A (en) * 1987-10-21 1989-02-07 International Business Machines Corporation Suspension and use thereof
US5094769A (en) * 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound
US5213704A (en) * 1988-05-13 1993-05-25 International Business Machines Corporation Process for making a compliant thermally conductive compound
US5028984A (en) * 1988-11-04 1991-07-02 International Business Machines Corporation Epoxy composition and use thereof
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
US4960634A (en) * 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
EP0488273B1 (en) * 1990-11-28 1997-05-02 Hitachi, Ltd. Electrical device containing a lubricant or heat conducting composition.
US5167851A (en) * 1991-04-22 1992-12-01 Thermoset Plastics, Inc. Hydrophilic thermally conductive grease
US5250209A (en) * 1991-04-22 1993-10-05 Thermoset Plastics, Inc. Thermal coupling with water-washable thermally conductive grease
US5190595A (en) * 1991-09-03 1993-03-02 International Business Machines Corporation Ozone safe stripping solution for thermal grease
US5441690A (en) * 1993-07-06 1995-08-15 International Business Machines Corporation Process of making pinless connector
US5548486A (en) * 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5652055A (en) * 1994-07-20 1997-07-29 W. L. Gore & Associates, Inc. Matched low dielectric constant, dimensionally stable adhesive sheet
CN1177370A (zh) * 1995-01-14 1998-03-25 约亨·多米 载热浓缩物及其制造方法和应用以及潜热贮存装置
US5878483A (en) * 1995-06-01 1999-03-09 International Business Machines Corporation Hammer for forming bulges in an array of compliant pin blanks
US5950066A (en) * 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
JP3142800B2 (ja) * 1996-08-09 2001-03-07 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース
JP2000114438A (ja) * 1998-09-30 2000-04-21 Shin Etsu Chem Co Ltd 半導体装置
JP2000109373A (ja) * 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) * 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
US6160939A (en) * 1999-03-31 2000-12-12 Lucent Technologies Inc. Optical cable having a filling material with stable viscosity and yield stress
US6400565B1 (en) 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
US20030128519A1 (en) * 2002-01-08 2003-07-10 International Business Machine Corporartion Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using same
US7695817B2 (en) * 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
TWI385246B (zh) * 2004-05-21 2013-02-11 Shinetsu Chemical Co 聚矽氧烷潤滑油組成物
JP2007005670A (ja) * 2005-06-27 2007-01-11 Fujitsu Ltd 電子部品パッケージおよび接合組立体
DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4514058B2 (ja) 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5489409B2 (ja) * 2007-04-10 2014-05-14 コスモ石油ルブリカンツ株式会社 高熱伝導性コンパウンド
WO2009131913A2 (en) * 2008-04-21 2009-10-29 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US8546476B2 (en) * 2009-07-14 2013-10-01 Sakai Chemical Industry Co., Ltd. Exoergic filler composition, resin composition, exoergic grease and exoergic coating composition
DE102010003330A1 (de) * 2010-03-26 2011-09-29 Robert Bosch Gmbh Wärmeleitende Anordnung zwischen zwei Bauteilen und Verfahren zum Herstellen einer wärmeleitenden Anordnung
WO2013158071A1 (en) * 2012-04-16 2013-10-24 Clustered Systems Company Cold plate with reduced bubble effects
WO2017119937A1 (en) 2016-01-07 2017-07-13 Xilinx, Inc. Stacked silicon package assembly having enhanced stiffener
JP6590079B2 (ja) 2016-10-14 2019-10-16 信越化学工業株式会社 熱伝導性複合シリコーンゴムシートおよびその製造方法
JP7031203B2 (ja) * 2017-09-29 2022-03-08 東洋インキＳｃホールディングス株式会社 放熱用接着シート、放熱接着部材用積層体、及び複合部材
JP6919716B2 (ja) 2017-11-09 2021-08-18 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN108192576B (zh) * 2017-12-05 2021-02-02 云南靖创液态金属热控技术研发有限公司 一种液态金属热界面材料及其制备方法和应用
JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
KR102560192B1 (ko) 2020-03-05 2023-07-28 다우 실리콘즈 코포레이션 전단 담화 열전도성 실리콘 조성물

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2428608A (en) * 1942-11-02 1947-10-07 Dow Chemical Co Plastic dielectric composition and shielded spark plug terminal construction comprising same
US3405066A (en) * 1965-01-22 1968-10-08 Union Carbide Corp High thermal conductivity fluid dielectric
US3499859A (en) * 1968-07-05 1970-03-10 Dow Corning Stable thermally conductive room temperature vulcanizable silicone rubber
US3882033A (en) * 1971-07-06 1975-05-06 Gen Electric Silicone grease for semiconductors
US3885984A (en) * 1973-12-18 1975-05-27 Gen Electric Methyl alkyl silicone thermoconducting compositions
DE2556420A1 (de) * 1975-12-15 1977-06-16 Wacker Chemie Gmbh Zu elastomeren haertbare massen auf grundlage von diorganopolysiloxanen und verfahren zum herstellen von organopolysiloxanelastomeren

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0896031A3 (en) * 1997-08-06 2000-01-26 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
US6632780B2 (en) 2001-01-04 2003-10-14 Hitachi, Ltd. Highly thermal conductive grease composition and cooling device using the same
JP2007177921A (ja) * 2005-12-28 2007-07-12 Nsk Ltd ボールねじ装置
WO2020162460A1 (ja) 2019-02-07 2020-08-13 信越化学工業株式会社 熱伝導性粘着層を有する熱伝導性シリコーンゴムシート
EP4219643A1 (en) 2019-02-07 2023-08-02 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone rubber sheet comprising a thermally conductive adhesive layer

Also Published As

Publication number Publication date
US4265775A (en) 1981-05-05
EP0024498A1 (en) 1981-03-11
EP0024498B1 (en) 1982-11-24
JPS5628264A (en) 1981-03-19
DE3061149D1 (en) 1982-12-30

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