JPS5734856B2 - - Google Patents
Info
- Publication number
- JPS5734856B2 JPS5734856B2 JP5405079A JP5405079A JPS5734856B2 JP S5734856 B2 JPS5734856 B2 JP S5734856B2 JP 5405079 A JP5405079 A JP 5405079A JP 5405079 A JP5405079 A JP 5405079A JP S5734856 B2 JPS5734856 B2 JP S5734856B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5405079A JPS55145725A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5405079A JPS55145725A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55145725A JPS55145725A (en) | 1980-11-13 |
| JPS5734856B2 true JPS5734856B2 (OSRAM) | 1982-07-26 |
Family
ID=12959774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5405079A Granted JPS55145725A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55145725A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63112856U (OSRAM) * | 1987-01-19 | 1988-07-20 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
| JPS58113226A (ja) * | 1981-12-26 | 1983-07-06 | Toho Rayon Co Ltd | ストランドプリプレグ及びその製法 |
| JPS59135217A (ja) * | 1982-12-21 | 1984-08-03 | Nippon Debukon Kk | 耐熱性グラウト材の製造法 |
| JPH0643484B2 (ja) * | 1990-07-24 | 1994-06-08 | 松下電工株式会社 | 封止用エポキシ樹脂組成物 |
| JPH0643485B2 (ja) * | 1990-07-24 | 1994-06-08 | 松下電工株式会社 | 封止用樹脂組成物 |
| ES2115730T3 (es) * | 1992-10-09 | 1998-07-01 | Gen Electric | Sistema de resinas de polieter de fenileno/poliepoxido. |
| JP5895342B2 (ja) * | 2011-01-18 | 2016-03-30 | 日立化成株式会社 | 熱硬化性樹脂組成物及びこれを用いたプリプレグ、積層板並びにプリント配線板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5813591B2 (ja) * | 1974-10-31 | 1983-03-14 | ニツポンペイント カブシキガイシヤ | ネツコウカセイヒフクソセイブツ |
| US4082719A (en) * | 1976-02-23 | 1978-04-04 | Dow Corning Corporation | Silicone epoxy curable compositions |
-
1979
- 1979-05-04 JP JP5405079A patent/JPS55145725A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63112856U (OSRAM) * | 1987-01-19 | 1988-07-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55145725A (en) | 1980-11-13 |