JPS5732909B2 - - Google Patents

Info

Publication number
JPS5732909B2
JPS5732909B2 JP5866476A JP5866476A JPS5732909B2 JP S5732909 B2 JPS5732909 B2 JP S5732909B2 JP 5866476 A JP5866476 A JP 5866476A JP 5866476 A JP5866476 A JP 5866476A JP S5732909 B2 JPS5732909 B2 JP S5732909B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5866476A
Other languages
Japanese (ja)
Other versions
JPS52141566A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5866476A priority Critical patent/JPS52141566A/en
Publication of JPS52141566A publication Critical patent/JPS52141566A/en
Publication of JPS5732909B2 publication Critical patent/JPS5732909B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
JP5866476A 1976-05-20 1976-05-20 Semiconductor device and its manufacture Granted JPS52141566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5866476A JPS52141566A (en) 1976-05-20 1976-05-20 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5866476A JPS52141566A (en) 1976-05-20 1976-05-20 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
JPS52141566A JPS52141566A (en) 1977-11-25
JPS5732909B2 true JPS5732909B2 (en) 1982-07-14

Family

ID=13090843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5866476A Granted JPS52141566A (en) 1976-05-20 1976-05-20 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS52141566A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174969A (en) * 1984-02-21 1985-09-09 Asahi Optical Co Ltd Light quantity adjustor for light wave range finder

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553657A (en) * 1978-06-21 1980-01-11 Matsushita Electric Ind Co Ltd Electronic circuit device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174969A (en) * 1984-02-21 1985-09-09 Asahi Optical Co Ltd Light quantity adjustor for light wave range finder

Also Published As

Publication number Publication date
JPS52141566A (en) 1977-11-25

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