JPS573234B2 - - Google Patents

Info

Publication number
JPS573234B2
JPS573234B2 JP8964372A JP8964372A JPS573234B2 JP S573234 B2 JPS573234 B2 JP S573234B2 JP 8964372 A JP8964372 A JP 8964372A JP 8964372 A JP8964372 A JP 8964372A JP S573234 B2 JPS573234 B2 JP S573234B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8964372A
Other languages
Japanese (ja)
Other versions
JPS4873762A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4873762A publication Critical patent/JPS4873762A/ja
Publication of JPS573234B2 publication Critical patent/JPS573234B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
JP8964372A 1972-01-04 1972-09-08 Expired JPS573234B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21539572A 1972-01-04 1972-01-04

Publications (2)

Publication Number Publication Date
JPS4873762A JPS4873762A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-10-04
JPS573234B2 true JPS573234B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-01-20

Family

ID=22802825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8964372A Expired JPS573234B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-01-04 1972-09-08

Country Status (2)

Country Link
JP (1) JPS573234B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2166347A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012018091A1 (ja) 2010-08-06 2012-02-09 日立化成工業株式会社 液状組成物、並びに、それを用いた抵抗体膜、抵抗体素子及び配線板

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
FR2554046B1 (fr) * 1983-10-28 1986-05-09 Gen Electric Stratifie recouvert de metal et procede de fabrication
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
JP3954958B2 (ja) 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 抵抗層付き銅箔及び抵抗層付き回路基板材料
JP4217778B2 (ja) 2003-04-11 2009-02-04 古河電気工業株式会社 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板
JP2006005149A (ja) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk 抵抗層付き導電性基材及び抵抗層付き回路基板材料
CN107675176B (zh) * 2017-08-21 2019-05-17 陕西天元智能再制造股份有限公司 一种微弧氧化与真空熔覆相结合的工件表面强化处理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
FR1366903A (fr) * 1963-06-04 1964-07-17 Ass Ouvriers Instr Precision Résistances imprimées et leur procédé de fabrication
GB1157618A (en) * 1965-09-13 1969-07-09 Engelhard Ind Ltd Laminate for Use in the Production of Printed Electrical Circuit Elements.
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012018091A1 (ja) 2010-08-06 2012-02-09 日立化成工業株式会社 液状組成物、並びに、それを用いた抵抗体膜、抵抗体素子及び配線板

Also Published As

Publication number Publication date
FR2166347A1 (en) 1973-08-17
FR2166347B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-12-30
JPS4873762A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-10-04

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