JPS5731667B2 - - Google Patents

Info

Publication number
JPS5731667B2
JPS5731667B2 JP12554676A JP12554676A JPS5731667B2 JP S5731667 B2 JPS5731667 B2 JP S5731667B2 JP 12554676 A JP12554676 A JP 12554676A JP 12554676 A JP12554676 A JP 12554676A JP S5731667 B2 JPS5731667 B2 JP S5731667B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12554676A
Other languages
Japanese (ja)
Other versions
JPS5271681A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5271681A publication Critical patent/JPS5271681A/ja
Publication of JPS5731667B2 publication Critical patent/JPS5731667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP51125546A 1975-10-22 1976-10-21 Method of forming printed circuit unit Granted JPS5271681A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB43289/75A GB1497312A (en) 1975-10-22 1975-10-22 Production of printed circuit arrangements

Publications (2)

Publication Number Publication Date
JPS5271681A JPS5271681A (en) 1977-06-15
JPS5731667B2 true JPS5731667B2 (OSRAM) 1982-07-06

Family

ID=10428105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51125546A Granted JPS5271681A (en) 1975-10-22 1976-10-21 Method of forming printed circuit unit

Country Status (5)

Country Link
JP (1) JPS5271681A (OSRAM)
AU (1) AU498261B2 (OSRAM)
DE (1) DE2645947C2 (OSRAM)
GB (1) GB1497312A (OSRAM)
ZA (1) ZA765930B (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501638A (en) * 1983-12-05 1985-02-26 E. I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer
US4472238A (en) * 1983-12-05 1984-09-18 E. I. Du Pont De Nemours And Company Process using plasma for forming conductive through-holes through a dielectric layer
US4517050A (en) * 1983-12-05 1985-05-14 E. I. Du Pont De Nemours And Company Process for forming conductive through-holes through a dielectric layer
RU2138140C1 (ru) * 1998-11-30 1999-09-20 Самарцев Николай Борисович Способ изготовления гибридных интегральных схем и печатных плат на полимерной подложке
DE202014006674U1 (de) * 2014-08-20 2015-11-23 Automotive Lighting Reutlingen Gmbh Leiterplatte für Kraftfahrzeugbeleuchtungseinrichtungen
CN112235951B (zh) * 2020-10-20 2021-09-21 盐城维信电子有限公司 一种不同铜厚的线路板制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
US3268653A (en) * 1964-04-29 1966-08-23 Ibm Printed circuit board with solder resistant coating in the through-hole connectors
US3471631A (en) * 1968-04-03 1969-10-07 Us Air Force Fabrication of microminiature multilayer circuit boards
US3871930A (en) * 1973-12-19 1975-03-18 Texas Instruments Inc Method of etching films made of polyimide based polymers

Also Published As

Publication number Publication date
AU1862476A (en) 1978-04-20
DE2645947C2 (de) 1983-01-27
ZA765930B (en) 1977-09-28
GB1497312A (en) 1978-01-05
JPS5271681A (en) 1977-06-15
AU498261B2 (en) 1979-02-22
DE2645947A1 (de) 1977-04-28

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