JPS5731665B2 - - Google Patents

Info

Publication number
JPS5731665B2
JPS5731665B2 JP10619875A JP10619875A JPS5731665B2 JP S5731665 B2 JPS5731665 B2 JP S5731665B2 JP 10619875 A JP10619875 A JP 10619875A JP 10619875 A JP10619875 A JP 10619875A JP S5731665 B2 JPS5731665 B2 JP S5731665B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10619875A
Other languages
Japanese (ja)
Other versions
JPS5229749A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10619875A priority Critical patent/JPS5229749A/en
Publication of JPS5229749A publication Critical patent/JPS5229749A/en
Publication of JPS5731665B2 publication Critical patent/JPS5731665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
JP10619875A 1975-09-02 1975-09-02 Optical equipment and its manufacturing process Granted JPS5229749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10619875A JPS5229749A (en) 1975-09-02 1975-09-02 Optical equipment and its manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10619875A JPS5229749A (en) 1975-09-02 1975-09-02 Optical equipment and its manufacturing process

Publications (2)

Publication Number Publication Date
JPS5229749A JPS5229749A (en) 1977-03-05
JPS5731665B2 true JPS5731665B2 (en) 1982-07-06

Family

ID=14427465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10619875A Granted JPS5229749A (en) 1975-09-02 1975-09-02 Optical equipment and its manufacturing process

Country Status (1)

Country Link
JP (1) JPS5229749A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104898211A (en) * 2014-03-04 2015-09-09 株式会社东芝 Optical link device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0053483B1 (en) * 1980-11-28 1985-10-02 Kabushiki Kaisha Toshiba Method for manufacturing a module for a fiber optic link
TW323284B (en) * 1992-03-23 1997-12-21 Novartis Ag
DE69218431T2 (en) * 1992-10-14 1997-09-25 Ibm Encapsulated, light emitting diode and encapsulation process
JP5892292B2 (en) * 2013-06-07 2016-03-23 株式会社村田製作所 Optical plug and optical connector
US20190129108A1 (en) 2017-10-31 2019-05-02 Versalume LLC Modular Laser Connector Packaging System and Method
US10551542B1 (en) 2018-12-11 2020-02-04 Corning Incorporated Light modules and devices incorporating light modules

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918344A (en) * 1972-06-12 1974-02-18
JPS524852A (en) * 1975-06-05 1977-01-14 Western Electric Co Sealing of device capsule unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918344A (en) * 1972-06-12 1974-02-18
JPS524852A (en) * 1975-06-05 1977-01-14 Western Electric Co Sealing of device capsule unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104898211A (en) * 2014-03-04 2015-09-09 株式会社东芝 Optical link device

Also Published As

Publication number Publication date
JPS5229749A (en) 1977-03-05

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