JPS524852A - Sealing of device capsule unit - Google Patents

Sealing of device capsule unit

Info

Publication number
JPS524852A
JPS524852A JP51064709A JP6470976A JPS524852A JP S524852 A JPS524852 A JP S524852A JP 51064709 A JP51064709 A JP 51064709A JP 6470976 A JP6470976 A JP 6470976A JP S524852 A JPS524852 A JP S524852A
Authority
JP
Japan
Prior art keywords
sealing
capsule unit
device capsule
unit
capsule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51064709A
Other languages
Japanese (ja)
Inventor
Robaato Kairu Toomasu
Aasaa Pinou Dagurasu
Pooru Shinku Deibuitsudo
Jieraado Buan Uitaat Regurando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of JPS524852A publication Critical patent/JPS524852A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
JP51064709A 1975-06-05 1976-06-04 Sealing of device capsule unit Pending JPS524852A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58387775A 1975-06-05 1975-06-05

Publications (1)

Publication Number Publication Date
JPS524852A true JPS524852A (en) 1977-01-14

Family

ID=24334959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51064709A Pending JPS524852A (en) 1975-06-05 1976-06-04 Sealing of device capsule unit

Country Status (4)

Country Link
JP (1) JPS524852A (en)
CA (1) CA1065140A (en)
DE (1) DE2624919A1 (en)
FR (1) FR2313688A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229749A (en) * 1975-09-02 1977-03-05 Mitsubishi Electric Corp Optical equipment and its manufacturing process
JPS5446433A (en) * 1977-09-21 1979-04-12 Toshiba Corp Conversational unit to controller
CN104345405A (en) * 2013-08-08 2015-02-11 杨泽清 Encapsulation structure for photoelectric conversion chip for plastic optical fiber communication

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4457582A (en) * 1977-12-23 1984-07-03 Elliott Brothers (London) Limited Fibre optic terminals for use with bidirectional optical fibres
US4186994A (en) * 1978-04-21 1980-02-05 Bell Telephone Laboratories, Incorporated Arrangement for coupling between an electrooptic device and an optical fiber
US4240090A (en) * 1978-06-14 1980-12-16 Rca Corporation Electroluminescent semiconductor device with fiber-optic face plate
FR2446497A1 (en) * 1979-01-09 1980-08-08 Thomson Csf Opto-electronic coupling head - mounted in transistor type housing for accurate orientation w.r.t. fibre=optic cable
FR2448727A1 (en) * 1979-02-08 1980-09-05 Thomson Csf OPTO-ELECTRONIC COUPLING HEAD
US4296998A (en) * 1979-12-17 1981-10-27 Bell Telephone Laboratories, Incorporated Encapsulated light source with coupled fiberguide
EP0053483B1 (en) * 1980-11-28 1985-10-02 Kabushiki Kaisha Toshiba Method for manufacturing a module for a fiber optic link

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229749A (en) * 1975-09-02 1977-03-05 Mitsubishi Electric Corp Optical equipment and its manufacturing process
JPS5731665B2 (en) * 1975-09-02 1982-07-06
JPS5446433A (en) * 1977-09-21 1979-04-12 Toshiba Corp Conversational unit to controller
CN104345405A (en) * 2013-08-08 2015-02-11 杨泽清 Encapsulation structure for photoelectric conversion chip for plastic optical fiber communication

Also Published As

Publication number Publication date
DE2624919A1 (en) 1976-12-16
CA1065140A (en) 1979-10-30
FR2313688A1 (en) 1976-12-31

Similar Documents

Publication Publication Date Title
EG11761A (en) The device for inhelation of the drugs
ZA766730B (en) Capsules
ZA76766B (en) Bidirectional seal
JPS51134966A (en) Sealing unit
JPS5279149A (en) Rotary seal apparatus
IL45940A0 (en) Capsule rectification apparatus
JPS5219101A (en) Packing device for construction of wellhead
JPS51145513A (en) Method of sealing ceramicssmetal
JPS524852A (en) Sealing of device capsule unit
JPS52134963A (en) Elements of sealing device
JPS51122580A (en) Sealed can
JPS51128421A (en) Intestinally soluble capsule
ZA752313B (en) Sealing device
GB1546771A (en) Containment of fluids
JPS5253169A (en) Sealing device
ZA763807B (en) Device for protection of an armour-walled port
JPS5284350A (en) Pressure sealing device
ZA757702B (en) Adjustable sealing device
JPS5276555A (en) Sealing device
JPS51132617A (en) Capsule house
JPS5261323A (en) Connection device of frame body
JPS5282913A (en) Fusionncoat sealing treatment
AU2085676A (en) Sealing device
JPS5260197A (en) Continuous envelope sealing device
JPS5255903A (en) Sealing device