JPS5731299B2 - - Google Patents
Info
- Publication number
- JPS5731299B2 JPS5731299B2 JP11464574A JP11464574A JPS5731299B2 JP S5731299 B2 JPS5731299 B2 JP S5731299B2 JP 11464574 A JP11464574 A JP 11464574A JP 11464574 A JP11464574 A JP 11464574A JP S5731299 B2 JPS5731299 B2 JP S5731299B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11464574A JPS5141961A (en) | 1974-10-07 | 1974-10-07 | Handotai shusekikairosochoriidofureemu |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11464574A JPS5141961A (en) | 1974-10-07 | 1974-10-07 | Handotai shusekikairosochoriidofureemu |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58052102A Division JPS58175852A (ja) | 1983-03-28 | 1983-03-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5141961A JPS5141961A (en) | 1976-04-08 |
| JPS5731299B2 true JPS5731299B2 (enrdf_load_stackoverflow) | 1982-07-03 |
Family
ID=14642974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11464574A Granted JPS5141961A (en) | 1974-10-07 | 1974-10-07 | Handotai shusekikairosochoriidofureemu |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5141961A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5817649A (ja) * | 1981-07-24 | 1983-02-01 | Fujitsu Ltd | 電子部品パツケ−ジ |
| JPS58175852A (ja) * | 1983-03-28 | 1983-10-15 | Nec Corp | 半導体装置 |
| JPS61258461A (ja) * | 1986-05-23 | 1986-11-15 | Hitachi Ltd | 電子部品 |
| JPS63111655A (ja) * | 1986-10-30 | 1988-05-16 | Toshiba Corp | 半導体素子用フレ−ムの表面処理方法 |
| JPS63291445A (ja) * | 1987-05-23 | 1988-11-29 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの２色部分メッキ方法 |
-
1974
- 1974-10-07 JP JP11464574A patent/JPS5141961A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5141961A (en) | 1976-04-08 |