JPS5728990A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
JPS5728990A
JPS5728990A JP10391180A JP10391180A JPS5728990A JP S5728990 A JPS5728990 A JP S5728990A JP 10391180 A JP10391180 A JP 10391180A JP 10391180 A JP10391180 A JP 10391180A JP S5728990 A JPS5728990 A JP S5728990A
Authority
JP
Japan
Prior art keywords
green sheets
grooves
heat pipe
ceramic heat
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10391180A
Other languages
Japanese (ja)
Inventor
Migiwa Ando
Akiyo Kasugai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP10391180A priority Critical patent/JPS5728990A/en
Publication of JPS5728990A publication Critical patent/JPS5728990A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a ceramic heat pipe having excellent efficiency for cooling a semiconductor or the like by providing a wick groove in the inner wall of a ceramic heat pipe and providing a main wick of a porous inorganic body continuously connected to the wick groove.
CONSTITUTION: V-grooves 4A are formed on the back surface of a green sheet on the surface of which an electric circuit wiring 1 for loading a semiconductor element is printed. V-grooves 4C are formed in another green sheet. V-grooves 6 are provided in two another green sheets which are opened window frams 5A and 5B. A zirconic woven cloth 7 held between two green sheets 5 and bonded and fixed, and bonded between green sheets with V-grooves 4A and 4C and a paste 8 is applied and baked to the outer peripheries of the green sheets. Then, the green sheets are reduced in pressure by exhaust holes 3 and the operating liquid is poured therein from a pouring port 2. By this construction, a ceramic heat pipe adapted to cool the semiconductor or the like can be easily obtained.
COPYRIGHT: (C)1982,JPO&Japio
JP10391180A 1980-07-29 1980-07-29 Heat pipe Pending JPS5728990A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10391180A JPS5728990A (en) 1980-07-29 1980-07-29 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10391180A JPS5728990A (en) 1980-07-29 1980-07-29 Heat pipe

Publications (1)

Publication Number Publication Date
JPS5728990A true JPS5728990A (en) 1982-02-16

Family

ID=14366603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10391180A Pending JPS5728990A (en) 1980-07-29 1980-07-29 Heat pipe

Country Status (1)

Country Link
JP (1) JPS5728990A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184136A (en) * 1984-10-01 1986-04-28 Nec Corp Slip control circuit
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US6745825B1 (en) 1997-03-13 2004-06-08 Fujitsu Limited Plate type heat pipe
CN108488891A (en) * 2018-02-02 2018-09-04 清华大学 A kind of flat-plate heat pipe heating end of combination semiconductor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108050A (en) * 1978-02-13 1979-08-24 Oki Electric Cable Flat board type heat pipe

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108050A (en) * 1978-02-13 1979-08-24 Oki Electric Cable Flat board type heat pipe

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184136A (en) * 1984-10-01 1986-04-28 Nec Corp Slip control circuit
JPH0564495B2 (en) * 1984-10-01 1993-09-14 Nippon Electric Co
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US6745825B1 (en) 1997-03-13 2004-06-08 Fujitsu Limited Plate type heat pipe
CN108488891A (en) * 2018-02-02 2018-09-04 清华大学 A kind of flat-plate heat pipe heating end of combination semiconductor

Similar Documents

Publication Publication Date Title
JPS5742316A (en) Ceramic honeycomb filter
CA2243412A1 (en) Soldering iron
JPS5728990A (en) Heat pipe
HUT58409A (en) Prefabricated plate element for surface air-conditioning plants
JPS5416766A (en) Boiling heat transfer wall
FR2571921B1 (en) HEAT DISSIPATOR FOR ELECTRONIC COMPONENTS WITH CERAMIC SUBSTRATE
JPS5787588A (en) Heat pipe
JPS58196837U (en) Semiconductor wafer drying equipment
KR830002905Y1 (en) Block brick
JPS5346151A (en) Hot wind type heating equipment
DE3063614D1 (en) Filter arrangement for a photographic colour enlarging or copying apparatus
JPS5747187A (en) Heat exchange type blower
JPS551768A (en) Surface acoustic wave element
JPS5359957A (en) Ceramic heat transmission plate and method for producing same
JPS56146256A (en) Hybrid ic device
JPS5482185A (en) Manufacture of semiconductor device
JPS5594097A (en) Inner cistern low temperature tank
JPS5776865A (en) Manufacture of semiconductor device
JPS53142872A (en) Manufacture for compound semiconductor device
JPS57157551A (en) Heat sink device
SU1573329A1 (en) Heat exchanger
JPS579358A (en) Gasket for turbocharger
JPS5478538A (en) Exothermic resistor
JPS53109489A (en) Semiconductor pressure convertor
JPS5493583A (en) Prefabricated hybrid panel