JPS5728990A - Heat pipe - Google Patents
Heat pipeInfo
- Publication number
- JPS5728990A JPS5728990A JP10391180A JP10391180A JPS5728990A JP S5728990 A JPS5728990 A JP S5728990A JP 10391180 A JP10391180 A JP 10391180A JP 10391180 A JP10391180 A JP 10391180A JP S5728990 A JPS5728990 A JP S5728990A
- Authority
- JP
- Japan
- Prior art keywords
- green sheets
- grooves
- heat pipe
- ceramic heat
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a ceramic heat pipe having excellent efficiency for cooling a semiconductor or the like by providing a wick groove in the inner wall of a ceramic heat pipe and providing a main wick of a porous inorganic body continuously connected to the wick groove.
CONSTITUTION: V-grooves 4A are formed on the back surface of a green sheet on the surface of which an electric circuit wiring 1 for loading a semiconductor element is printed. V-grooves 4C are formed in another green sheet. V-grooves 6 are provided in two another green sheets which are opened window frams 5A and 5B. A zirconic woven cloth 7 held between two green sheets 5 and bonded and fixed, and bonded between green sheets with V-grooves 4A and 4C and a paste 8 is applied and baked to the outer peripheries of the green sheets. Then, the green sheets are reduced in pressure by exhaust holes 3 and the operating liquid is poured therein from a pouring port 2. By this construction, a ceramic heat pipe adapted to cool the semiconductor or the like can be easily obtained.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10391180A JPS5728990A (en) | 1980-07-29 | 1980-07-29 | Heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10391180A JPS5728990A (en) | 1980-07-29 | 1980-07-29 | Heat pipe |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5728990A true JPS5728990A (en) | 1982-02-16 |
Family
ID=14366603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10391180A Pending JPS5728990A (en) | 1980-07-29 | 1980-07-29 | Heat pipe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5728990A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6184136A (en) * | 1984-10-01 | 1986-04-28 | Nec Corp | Slip control circuit |
US5769154A (en) * | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US6745825B1 (en) | 1997-03-13 | 2004-06-08 | Fujitsu Limited | Plate type heat pipe |
CN108488891A (en) * | 2018-02-02 | 2018-09-04 | 清华大学 | A kind of flat-plate heat pipe heating end of combination semiconductor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54108050A (en) * | 1978-02-13 | 1979-08-24 | Oki Electric Cable | Flat board type heat pipe |
-
1980
- 1980-07-29 JP JP10391180A patent/JPS5728990A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54108050A (en) * | 1978-02-13 | 1979-08-24 | Oki Electric Cable | Flat board type heat pipe |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6184136A (en) * | 1984-10-01 | 1986-04-28 | Nec Corp | Slip control circuit |
JPH0564495B2 (en) * | 1984-10-01 | 1993-09-14 | Nippon Electric Co | |
US5769154A (en) * | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US6745825B1 (en) | 1997-03-13 | 2004-06-08 | Fujitsu Limited | Plate type heat pipe |
CN108488891A (en) * | 2018-02-02 | 2018-09-04 | 清华大学 | A kind of flat-plate heat pipe heating end of combination semiconductor |
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