JPS5727164Y2 - - Google Patents

Info

Publication number
JPS5727164Y2
JPS5727164Y2 JP1976137250U JP13725076U JPS5727164Y2 JP S5727164 Y2 JPS5727164 Y2 JP S5727164Y2 JP 1976137250 U JP1976137250 U JP 1976137250U JP 13725076 U JP13725076 U JP 13725076U JP S5727164 Y2 JPS5727164 Y2 JP S5727164Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976137250U
Other languages
Japanese (ja)
Other versions
JPS5354365U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976137250U priority Critical patent/JPS5727164Y2/ja
Publication of JPS5354365U publication Critical patent/JPS5354365U/ja
Application granted granted Critical
Publication of JPS5727164Y2 publication Critical patent/JPS5727164Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1976137250U 1976-10-12 1976-10-12 Expired JPS5727164Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976137250U JPS5727164Y2 (https=) 1976-10-12 1976-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976137250U JPS5727164Y2 (https=) 1976-10-12 1976-10-12

Publications (2)

Publication Number Publication Date
JPS5354365U JPS5354365U (https=) 1978-05-10
JPS5727164Y2 true JPS5727164Y2 (https=) 1982-06-14

Family

ID=28746100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976137250U Expired JPS5727164Y2 (https=) 1976-10-12 1976-10-12

Country Status (1)

Country Link
JP (1) JPS5727164Y2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11904347B2 (en) 2019-04-24 2024-02-20 Henkel Ag & Co. Kgaa Vacuum impregnation device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818520Y2 (ja) * 1979-08-17 1983-04-15 渋谷金属産業株式会社 スライド式窓枠の引手

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513972Y2 (https=) * 1974-07-23 1980-03-29

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11904347B2 (en) 2019-04-24 2024-02-20 Henkel Ag & Co. Kgaa Vacuum impregnation device

Also Published As

Publication number Publication date
JPS5354365U (https=) 1978-05-10

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