JPS5727164Y2 - - Google Patents
Info
- Publication number
- JPS5727164Y2 JPS5727164Y2 JP1976137250U JP13725076U JPS5727164Y2 JP S5727164 Y2 JPS5727164 Y2 JP S5727164Y2 JP 1976137250 U JP1976137250 U JP 1976137250U JP 13725076 U JP13725076 U JP 13725076U JP S5727164 Y2 JPS5727164 Y2 JP S5727164Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976137250U JPS5727164Y2 (ja) | 1976-10-12 | 1976-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976137250U JPS5727164Y2 (ja) | 1976-10-12 | 1976-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5354365U JPS5354365U (ja) | 1978-05-10 |
| JPS5727164Y2 true JPS5727164Y2 (ja) | 1982-06-14 |
Family
ID=28746100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976137250U Expired JPS5727164Y2 (ja) | 1976-10-12 | 1976-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5727164Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11904347B2 (en) | 2019-04-24 | 2024-02-20 | Henkel Ag & Co. Kgaa | Vacuum impregnation device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5818520Y2 (ja) * | 1979-08-17 | 1983-04-15 | 渋谷金属産業株式会社 | スライド式窓枠の引手 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5513972Y2 (ja) * | 1974-07-23 | 1980-03-29 |
-
1976
- 1976-10-12 JP JP1976137250U patent/JPS5727164Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11904347B2 (en) | 2019-04-24 | 2024-02-20 | Henkel Ag & Co. Kgaa | Vacuum impregnation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5354365U (ja) | 1978-05-10 |