JPS5354365U - - Google Patents

Info

Publication number
JPS5354365U
JPS5354365U JP1976137250U JP13725076U JPS5354365U JP S5354365 U JPS5354365 U JP S5354365U JP 1976137250 U JP1976137250 U JP 1976137250U JP 13725076 U JP13725076 U JP 13725076U JP S5354365 U JPS5354365 U JP S5354365U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976137250U
Other languages
Japanese (ja)
Other versions
JPS5727164Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976137250U priority Critical patent/JPS5727164Y2/ja
Publication of JPS5354365U publication Critical patent/JPS5354365U/ja
Application granted granted Critical
Publication of JPS5727164Y2 publication Critical patent/JPS5727164Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1976137250U 1976-10-12 1976-10-12 Expired JPS5727164Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976137250U JPS5727164Y2 (https=) 1976-10-12 1976-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976137250U JPS5727164Y2 (https=) 1976-10-12 1976-10-12

Publications (2)

Publication Number Publication Date
JPS5354365U true JPS5354365U (https=) 1978-05-10
JPS5727164Y2 JPS5727164Y2 (https=) 1982-06-14

Family

ID=28746100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976137250U Expired JPS5727164Y2 (https=) 1976-10-12 1976-10-12

Country Status (1)

Country Link
JP (1) JPS5727164Y2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631156U (https=) * 1979-08-17 1981-03-26

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020215240A1 (en) 2019-04-24 2020-10-29 Henkel Ag & Co. Kgaa Vacuum impregnation device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115857U (https=) * 1974-07-23 1976-02-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115857U (https=) * 1974-07-23 1976-02-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631156U (https=) * 1979-08-17 1981-03-26

Also Published As

Publication number Publication date
JPS5727164Y2 (https=) 1982-06-14

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