JPS5726461A - Method of producing hybrid circuit including integrated capacitor and resistor and circuit obtained thereby - Google Patents

Method of producing hybrid circuit including integrated capacitor and resistor and circuit obtained thereby

Info

Publication number
JPS5726461A
JPS5726461A JP8878681A JP8878681A JPS5726461A JP S5726461 A JPS5726461 A JP S5726461A JP 8878681 A JP8878681 A JP 8878681A JP 8878681 A JP8878681 A JP 8878681A JP S5726461 A JPS5726461 A JP S5726461A
Authority
JP
Japan
Prior art keywords
resistor
including integrated
integrated capacitor
producing hybrid
circuit including
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8878681A
Other languages
English (en)
Other versions
JPH0250625B2 (ja
Inventor
Kurei Aran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS5726461A publication Critical patent/JPS5726461A/ja
Publication of JPH0250625B2 publication Critical patent/JPH0250625B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP8878681A 1980-06-11 1981-06-09 Method of producing hybrid circuit including integrated capacitor and resistor and circuit obtained thereby Granted JPS5726461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8012982A FR2484704A1 (fr) 1980-06-11 1980-06-11 Procede de fabrication de circuits hybrides a condensateurs et resistances integres et circuits obtenus par ce procede

Publications (2)

Publication Number Publication Date
JPS5726461A true JPS5726461A (en) 1982-02-12
JPH0250625B2 JPH0250625B2 (ja) 1990-11-02

Family

ID=9242967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8878681A Granted JPS5726461A (en) 1980-06-11 1981-06-09 Method of producing hybrid circuit including integrated capacitor and resistor and circuit obtained thereby

Country Status (4)

Country Link
US (1) US4460938A (ja)
JP (1) JPS5726461A (ja)
DE (1) DE3123213A1 (ja)
FR (1) FR2484704A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210549A (en) * 1988-06-17 1993-05-11 Canon Kabushiki Kaisha Ink jet recording head having resistor formed by oxidization
US5858197A (en) * 1988-06-17 1999-01-12 Canon Kabushiki Kaisha Process for manufacturing substrate for ink jet recording head using anodic oxidation
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
GB2259807B (en) * 1991-09-23 1995-09-06 Crystal Semiconductor Corp Low drift resistor structure
US5534465A (en) * 1995-01-10 1996-07-09 At&T Corp. Method for making multichip circuits using active semiconductor substrates
JPH0992512A (ja) * 1995-09-25 1997-04-04 Rohm Co Ltd チップ型複合電子部品及びその製造方法
US5745334A (en) * 1996-03-25 1998-04-28 International Business Machines Corporation Capacitor formed within printed circuit board
US6294827B1 (en) * 1996-09-26 2001-09-25 Samsung Electronics Co., Ltd. Hybrid microwave-frequency integrated circuit
US6225570B1 (en) * 1996-12-17 2001-05-01 Kokuriku Electric Industry Co., Ltd. Circuit board having electric component and its manufacturing method
US6075691A (en) * 1997-03-06 2000-06-13 Lucent Technologies Inc. Thin film capacitors and process for making them
US5872696A (en) * 1997-04-09 1999-02-16 Fujitsu Limited Sputtered and anodized capacitors capable of withstanding exposure to high temperatures
US6068782A (en) * 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
US6278356B1 (en) * 2000-05-17 2001-08-21 Compeq Manufacturing Company Limited Flat, built-in resistors and capacitors for a printed circuit board
US6492242B1 (en) * 2000-07-03 2002-12-10 Chartered Semiconductor Manufacturing Ltd. Method of forming of high K metallic dielectric layer
US6370012B1 (en) 2000-08-30 2002-04-09 International Business Machines Corporation Capacitor laminate for use in printed circuit board and as an interconnector
US7005722B2 (en) * 2001-01-26 2006-02-28 The Board Of Trustees Of The University Of Arkansas RC terminator and production method therefor
DE10344389A1 (de) * 2003-09-25 2005-05-19 Infineon Technologies Ag Verfahren zur Herstellung einer multifunktionellen Dielektrikumschicht auf einem Substrat
US7342804B2 (en) * 2004-08-09 2008-03-11 Cts Corporation Ball grid array resistor capacitor network
TWI321970B (en) * 2007-01-31 2010-03-11 Advanced Semiconductor Eng Package stucture with embedded capacitor and applications thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3542654A (en) * 1966-09-16 1970-11-24 Bell Telephone Labor Inc Process of making an rc circuit and calibrating same
US3801366A (en) * 1971-02-16 1974-04-02 J Lemelson Method of making an electrical circuit
DE2714034C3 (de) * 1977-03-30 1980-01-10 Lueder, Ernst, Prof. Dr.-Ing., 7000 Stuttgart Verfahren zur Herstellung temperaturkompensierter Dünnschichtschaltungen aus einer Schicht

Also Published As

Publication number Publication date
FR2484704A1 (fr) 1981-12-18
DE3123213A1 (de) 1982-03-04
US4460938A (en) 1984-07-17
JPH0250625B2 (ja) 1990-11-02
FR2484704B1 (ja) 1983-11-04

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