JPS5721880B2 - - Google Patents

Info

Publication number
JPS5721880B2
JPS5721880B2 JP13371678A JP13371678A JPS5721880B2 JP S5721880 B2 JPS5721880 B2 JP S5721880B2 JP 13371678 A JP13371678 A JP 13371678A JP 13371678 A JP13371678 A JP 13371678A JP S5721880 B2 JPS5721880 B2 JP S5721880B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13371678A
Other languages
Japanese (ja)
Other versions
JPS5562795A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13371678A priority Critical patent/JPS5562795A/ja
Publication of JPS5562795A publication Critical patent/JPS5562795A/ja
Publication of JPS5721880B2 publication Critical patent/JPS5721880B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP13371678A 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board Granted JPS5562795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13371678A JPS5562795A (en) 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13371678A JPS5562795A (en) 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board

Publications (2)

Publication Number Publication Date
JPS5562795A JPS5562795A (en) 1980-05-12
JPS5721880B2 true JPS5721880B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-05-10

Family

ID=15111224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13371678A Granted JPS5562795A (en) 1978-11-01 1978-11-01 Method of and device for soldering printed circuit board

Country Status (1)

Country Link
JP (1) JPS5562795A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990603U (ja) * 1982-12-08 1984-06-19 株式会社クボタ 油圧式作業装置昇降装置
JPS6338776A (ja) * 1986-07-31 1988-02-19 Teijin Seiki Co Ltd 絞り付き逆止弁

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140662U (ja) * 1982-03-17 1983-09-21 富士通株式会社 プリント板反り防止機構
JPS5929492A (ja) * 1982-08-10 1984-02-16 三洋電機株式会社 電子部品自動装着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990603U (ja) * 1982-12-08 1984-06-19 株式会社クボタ 油圧式作業装置昇降装置
JPS6338776A (ja) * 1986-07-31 1988-02-19 Teijin Seiki Co Ltd 絞り付き逆止弁

Also Published As

Publication number Publication date
JPS5562795A (en) 1980-05-12

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