JPS5721672U - - Google Patents

Info

Publication number
JPS5721672U
JPS5721672U JP1980099634U JP9963480U JPS5721672U JP S5721672 U JPS5721672 U JP S5721672U JP 1980099634 U JP1980099634 U JP 1980099634U JP 9963480 U JP9963480 U JP 9963480U JP S5721672 U JPS5721672 U JP S5721672U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980099634U
Other versions
JPS5928036Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980099634U priority Critical patent/JPS5928036Y2/ja
Priority to US06/279,314 priority patent/US4388140A/en
Publication of JPS5721672U publication Critical patent/JPS5721672U/ja
Application granted granted Critical
Publication of JPS5928036Y2 publication Critical patent/JPS5928036Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1980099634U 1980-07-15 1980-07-15 化学エツチング処理装置 Expired JPS5928036Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1980099634U JPS5928036Y2 (ja) 1980-07-15 1980-07-15 化学エツチング処理装置
US06/279,314 US4388140A (en) 1980-07-15 1981-07-01 Apparatus for wet treatment of wafer materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980099634U JPS5928036Y2 (ja) 1980-07-15 1980-07-15 化学エツチング処理装置

Publications (2)

Publication Number Publication Date
JPS5721672U true JPS5721672U (ja) 1982-02-04
JPS5928036Y2 JPS5928036Y2 (ja) 1984-08-14

Family

ID=14252497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980099634U Expired JPS5928036Y2 (ja) 1980-07-15 1980-07-15 化学エツチング処理装置

Country Status (2)

Country Link
US (1) US4388140A (ja)
JP (1) JPS5928036Y2 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4550242A (en) * 1981-10-05 1985-10-29 Tokyo Denshi Kagaku Kabushiki Kaisha Automatic plasma processing device and heat treatment device for batch treatment of workpieces
US4719144A (en) * 1986-02-18 1988-01-12 Crown Textile Company Fusible interlining fabric using high wet modulus rayon
IT1229640B (it) * 1987-06-29 1991-09-04 S G S Microelettronica S P A O Processo di conformazione del bordo di fette di materiale semiconduttore e relativa apparecchiatura
JPH0785471B2 (ja) * 1990-10-16 1995-09-13 信越半導体株式会社 エッチング装置
US5298111A (en) * 1991-05-31 1994-03-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer transfer apparatus and a method for transferring wafers and an etching drum
DE4305748A1 (de) * 1993-02-25 1994-09-01 Leybold Ag Vorrichtung zum Beschichten und/oder Ätzen von Substraten in einer Vakuumkammer
US5657879A (en) * 1996-02-05 1997-08-19 Seh America, Inc. Combination wafer carrier and storage device
US5880479A (en) * 1996-10-25 1999-03-09 Vanguard International Semiconductor Corporation Wafer aligner apparatus using different diameter rollers
TW402756B (en) * 1997-09-29 2000-08-21 Applied Materials Inc Method and apparatus for polishing and cleaning semiconductor wafers
US6864186B1 (en) * 1998-07-28 2005-03-08 Micron Technology, Inc. Method of reducing surface contamination in semiconductor wet-processing vessels
US6457929B2 (en) 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment
JP3810968B2 (ja) * 1999-12-03 2006-08-16 東京エレクトロン株式会社 液処理装置および液処理方法
US20030181042A1 (en) * 2002-03-19 2003-09-25 Taiwan Semiconductor Manufacturing Co., Ltd. Etching uniformity in wet bench tools
CN101981664B (zh) * 2008-03-31 2013-08-28 Memc电子材料有限公司 蚀刻硅晶片边缘的方法
EP2359390A1 (en) * 2008-11-19 2011-08-24 MEMC Electronic Materials, Inc. Method and system for stripping the edge of a semiconductor wafer
CN101569884B (zh) * 2009-06-02 2013-05-22 济源石晶光电频率技术有限公司 晶片、护边玻璃及厌氧胶条分离机
US8853054B2 (en) 2012-03-06 2014-10-07 Sunedison Semiconductor Limited Method of manufacturing silicon-on-insulator wafers
CN102737982B (zh) * 2012-06-18 2015-10-28 中国电子科技集团公司第四十八研究所 一种硅片运动式制绒装置
US10020213B1 (en) 2016-12-30 2018-07-10 Sunpower Corporation Semiconductor wafer carriers
US10068787B2 (en) * 2016-12-30 2018-09-04 Sunpower Corporation Bowing semiconductor wafers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964957A (en) * 1973-12-19 1976-06-22 Monsanto Company Apparatus for processing semiconductor wafers
FR2326479A1 (fr) * 1975-10-03 1977-04-29 Radiotechnique Compelec Procede de decapage de plaquettes semi-conductrices, notamment pour cellules solaires et appareillage de mise en oeuvre du procede

Also Published As

Publication number Publication date
US4388140A (en) 1983-06-14
JPS5928036Y2 (ja) 1984-08-14

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