JPS5721324Y2 - - Google Patents
Info
- Publication number
- JPS5721324Y2 JPS5721324Y2 JP1977038261U JP3826177U JPS5721324Y2 JP S5721324 Y2 JPS5721324 Y2 JP S5721324Y2 JP 1977038261 U JP1977038261 U JP 1977038261U JP 3826177 U JP3826177 U JP 3826177U JP S5721324 Y2 JPS5721324 Y2 JP S5721324Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977038261U JPS5721324Y2 (es) | 1977-03-29 | 1977-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977038261U JPS5721324Y2 (es) | 1977-03-29 | 1977-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53133571U JPS53133571U (es) | 1978-10-23 |
| JPS5721324Y2 true JPS5721324Y2 (es) | 1982-05-08 |
Family
ID=28902878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977038261U Expired JPS5721324Y2 (es) | 1977-03-29 | 1977-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5721324Y2 (es) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6138193Y2 (es) * | 1980-09-25 | 1986-11-05 | ||
| JP2705030B2 (ja) * | 1989-02-23 | 1998-01-26 | 凸版印刷株式会社 | リードフレームおよび放熱板および半導体装置 |
| JP2013222714A (ja) * | 2012-04-12 | 2013-10-28 | Denso Corp | 半導体装置の製造方法 |
-
1977
- 1977-03-29 JP JP1977038261U patent/JPS5721324Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53133571U (es) | 1978-10-23 |