JPS5721324Y2 - - Google Patents

Info

Publication number
JPS5721324Y2
JPS5721324Y2 JP1977038261U JP3826177U JPS5721324Y2 JP S5721324 Y2 JPS5721324 Y2 JP S5721324Y2 JP 1977038261 U JP1977038261 U JP 1977038261U JP 3826177 U JP3826177 U JP 3826177U JP S5721324 Y2 JPS5721324 Y2 JP S5721324Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977038261U
Other languages
Japanese (ja)
Other versions
JPS53133571U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977038261U priority Critical patent/JPS5721324Y2/ja
Publication of JPS53133571U publication Critical patent/JPS53133571U/ja
Application granted granted Critical
Publication of JPS5721324Y2 publication Critical patent/JPS5721324Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1977038261U 1977-03-29 1977-03-29 Expired JPS5721324Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977038261U JPS5721324Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-03-29 1977-03-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977038261U JPS5721324Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-03-29 1977-03-29

Publications (2)

Publication Number Publication Date
JPS53133571U JPS53133571U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-10-23
JPS5721324Y2 true JPS5721324Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-05-08

Family

ID=28902878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977038261U Expired JPS5721324Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-03-29 1977-03-29

Country Status (1)

Country Link
JP (1) JPS5721324Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138193Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-09-25 1986-11-05
JP2705030B2 (ja) * 1989-02-23 1998-01-26 凸版印刷株式会社 リードフレームおよび放熱板および半導体装置
JP2013222714A (ja) * 2012-04-12 2013-10-28 Denso Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS53133571U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-10-23

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