JPS57210963A - Pretreatment for wire rod - Google Patents

Pretreatment for wire rod

Info

Publication number
JPS57210963A
JPS57210963A JP56097263A JP9726381A JPS57210963A JP S57210963 A JPS57210963 A JP S57210963A JP 56097263 A JP56097263 A JP 56097263A JP 9726381 A JP9726381 A JP 9726381A JP S57210963 A JPS57210963 A JP S57210963A
Authority
JP
Japan
Prior art keywords
rod
wire rod
copper wire
passed
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56097263A
Other languages
Japanese (ja)
Inventor
Teishiro Moriyasu
Takehiko Shinoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP56097263A priority Critical patent/JPS57210963A/en
Publication of JPS57210963A publication Critical patent/JPS57210963A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To pretreat a copper wire rod perfectly and to make plating treatment in succession to this uniform by heating said wire rod then immersing the rod in an aq. soln. contg. a reducing agent, and subjecting this to an acid treatment followed by a plating treatment. CONSTITUTION:A wire rod such as mild copper wire or hard copper wire is passed through a pipe 12 in a heating furnace 11 which is heated to about 400- 700 deg.C. This rod 17 is passed through a water tank 14 where the leading end 13 of the pipe 12 is located in a soln. contg. a reducing agent such as alcohol, so that the surface of the rod 17 is cleaned by reduction. This is passed through a pretreating tank 15, where it is applied with an acid treatment with aq. mixed solns. of zinc chloride and hydrochloric acid, after which it is plated in a plating tank 16 and is coiled as a plated wire rod 18. The pretreatment and the plating treatment are accomplished perfectly by such method. This plated copper wire is effective for applications such as lead wires of resistance capacitors and electronic wires.
JP56097263A 1981-06-22 1981-06-22 Pretreatment for wire rod Pending JPS57210963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56097263A JPS57210963A (en) 1981-06-22 1981-06-22 Pretreatment for wire rod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56097263A JPS57210963A (en) 1981-06-22 1981-06-22 Pretreatment for wire rod

Publications (1)

Publication Number Publication Date
JPS57210963A true JPS57210963A (en) 1982-12-24

Family

ID=14187648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56097263A Pending JPS57210963A (en) 1981-06-22 1981-06-22 Pretreatment for wire rod

Country Status (1)

Country Link
JP (1) JPS57210963A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100676523B1 (en) 2005-06-23 2007-02-01 덕산산업주식회사 Preprocessing method for hot-dip aluminizing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100676523B1 (en) 2005-06-23 2007-02-01 덕산산업주식회사 Preprocessing method for hot-dip aluminizing

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