JPS57210963A - Pretreatment for wire rod - Google Patents
Pretreatment for wire rodInfo
- Publication number
- JPS57210963A JPS57210963A JP56097263A JP9726381A JPS57210963A JP S57210963 A JPS57210963 A JP S57210963A JP 56097263 A JP56097263 A JP 56097263A JP 9726381 A JP9726381 A JP 9726381A JP S57210963 A JPS57210963 A JP S57210963A
- Authority
- JP
- Japan
- Prior art keywords
- rod
- wire rod
- copper wire
- passed
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 238000007747 plating Methods 0.000 abstract 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 2
- 238000010306 acid treatment Methods 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 235000005074 zinc chloride Nutrition 0.000 abstract 1
- 239000011592 zinc chloride Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Abstract
PURPOSE:To pretreat a copper wire rod perfectly and to make plating treatment in succession to this uniform by heating said wire rod then immersing the rod in an aq. soln. contg. a reducing agent, and subjecting this to an acid treatment followed by a plating treatment. CONSTITUTION:A wire rod such as mild copper wire or hard copper wire is passed through a pipe 12 in a heating furnace 11 which is heated to about 400- 700 deg.C. This rod 17 is passed through a water tank 14 where the leading end 13 of the pipe 12 is located in a soln. contg. a reducing agent such as alcohol, so that the surface of the rod 17 is cleaned by reduction. This is passed through a pretreating tank 15, where it is applied with an acid treatment with aq. mixed solns. of zinc chloride and hydrochloric acid, after which it is plated in a plating tank 16 and is coiled as a plated wire rod 18. The pretreatment and the plating treatment are accomplished perfectly by such method. This plated copper wire is effective for applications such as lead wires of resistance capacitors and electronic wires.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56097263A JPS57210963A (en) | 1981-06-22 | 1981-06-22 | Pretreatment for wire rod |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56097263A JPS57210963A (en) | 1981-06-22 | 1981-06-22 | Pretreatment for wire rod |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57210963A true JPS57210963A (en) | 1982-12-24 |
Family
ID=14187648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56097263A Pending JPS57210963A (en) | 1981-06-22 | 1981-06-22 | Pretreatment for wire rod |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57210963A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100676523B1 (en) | 2005-06-23 | 2007-02-01 | 덕산산업주식회사 | Preprocessing method for hot-dip aluminizing |
-
1981
- 1981-06-22 JP JP56097263A patent/JPS57210963A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100676523B1 (en) | 2005-06-23 | 2007-02-01 | 덕산산업주식회사 | Preprocessing method for hot-dip aluminizing |
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