JPS57205418A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS57205418A JPS57205418A JP7618981A JP7618981A JPS57205418A JP S57205418 A JPS57205418 A JP S57205418A JP 7618981 A JP7618981 A JP 7618981A JP 7618981 A JP7618981 A JP 7618981A JP S57205418 A JPS57205418 A JP S57205418A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- colorless
- pale
- cured product
- polybasic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7618981A JPS57205418A (en) | 1981-05-19 | 1981-05-19 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7618981A JPS57205418A (en) | 1981-05-19 | 1981-05-19 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57205418A true JPS57205418A (en) | 1982-12-16 |
JPS6136851B2 JPS6136851B2 (ja) | 1986-08-20 |
Family
ID=13598174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7618981A Granted JPS57205418A (en) | 1981-05-19 | 1981-05-19 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57205418A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001316568A (ja) * | 2000-04-28 | 2001-11-16 | Asahi Denka Kogyo Kk | エポキシ樹脂組成物 |
US6403690B1 (en) * | 1999-06-09 | 2002-06-11 | Matsushita Electric Works, Ltd. | Flame retardant resin composition |
JP2012167167A (ja) * | 2011-02-14 | 2012-09-06 | Dic Corp | 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 |
JP2012172069A (ja) * | 2011-02-22 | 2012-09-10 | Dic Corp | 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6470777A (en) * | 1987-09-10 | 1989-03-16 | Canon Kk | Image forming device |
-
1981
- 1981-05-19 JP JP7618981A patent/JPS57205418A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6403690B1 (en) * | 1999-06-09 | 2002-06-11 | Matsushita Electric Works, Ltd. | Flame retardant resin composition |
JP2001316568A (ja) * | 2000-04-28 | 2001-11-16 | Asahi Denka Kogyo Kk | エポキシ樹脂組成物 |
JP2012167167A (ja) * | 2011-02-14 | 2012-09-06 | Dic Corp | 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 |
JP2012172069A (ja) * | 2011-02-22 | 2012-09-10 | Dic Corp | 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
JPS6136851B2 (ja) | 1986-08-20 |
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