JPS57205418A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57205418A
JPS57205418A JP7618981A JP7618981A JPS57205418A JP S57205418 A JPS57205418 A JP S57205418A JP 7618981 A JP7618981 A JP 7618981A JP 7618981 A JP7618981 A JP 7618981A JP S57205418 A JPS57205418 A JP S57205418A
Authority
JP
Japan
Prior art keywords
epoxy resin
colorless
pale
cured product
polybasic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7618981A
Other languages
English (en)
Other versions
JPS6136851B2 (ja
Inventor
Kazuhide Nakajima
Shigeo Tanaka
Takeshi Nakahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP7618981A priority Critical patent/JPS57205418A/ja
Publication of JPS57205418A publication Critical patent/JPS57205418A/ja
Publication of JPS6136851B2 publication Critical patent/JPS6136851B2/ja
Granted legal-status Critical Current

Links

JP7618981A 1981-05-19 1981-05-19 Epoxy resin composition Granted JPS57205418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7618981A JPS57205418A (en) 1981-05-19 1981-05-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7618981A JPS57205418A (en) 1981-05-19 1981-05-19 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS57205418A true JPS57205418A (en) 1982-12-16
JPS6136851B2 JPS6136851B2 (ja) 1986-08-20

Family

ID=13598174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7618981A Granted JPS57205418A (en) 1981-05-19 1981-05-19 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57205418A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316568A (ja) * 2000-04-28 2001-11-16 Asahi Denka Kogyo Kk エポキシ樹脂組成物
US6403690B1 (en) * 1999-06-09 2002-06-11 Matsushita Electric Works, Ltd. Flame retardant resin composition
JP2012167167A (ja) * 2011-02-14 2012-09-06 Dic Corp 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物
JP2012172069A (ja) * 2011-02-22 2012-09-10 Dic Corp 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6470777A (en) * 1987-09-10 1989-03-16 Canon Kk Image forming device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6403690B1 (en) * 1999-06-09 2002-06-11 Matsushita Electric Works, Ltd. Flame retardant resin composition
JP2001316568A (ja) * 2000-04-28 2001-11-16 Asahi Denka Kogyo Kk エポキシ樹脂組成物
JP2012167167A (ja) * 2011-02-14 2012-09-06 Dic Corp 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物
JP2012172069A (ja) * 2011-02-22 2012-09-10 Dic Corp 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物

Also Published As

Publication number Publication date
JPS6136851B2 (ja) 1986-08-20

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