JPS57202790A - Manufacture of electronic part terminal - Google Patents

Manufacture of electronic part terminal

Info

Publication number
JPS57202790A
JPS57202790A JP8854881A JP8854881A JPS57202790A JP S57202790 A JPS57202790 A JP S57202790A JP 8854881 A JP8854881 A JP 8854881A JP 8854881 A JP8854881 A JP 8854881A JP S57202790 A JPS57202790 A JP S57202790A
Authority
JP
Japan
Prior art keywords
piece
pinching piece
protruded
terminal
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8854881A
Other languages
Japanese (ja)
Inventor
Naoki Matsuura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP8854881A priority Critical patent/JPS57202790A/en
Publication of JPS57202790A publication Critical patent/JPS57202790A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To reduce the processing and assembling manhours for the terminal by a method wherein a pair of terminals with an element pinching piece are punched out from the same conductive plate by performing a press work while they are being connected using the remainder connected part, and one of the pinching piece is bent and opposed to the other pinching piece in parallel with each other. CONSTITUTION:A pair of terminals 11 and 12, to be brought into one body using remainder connected part 13, are formed by performing punching and press works on the same conductive plate at the same time. In this constitution, an element pinching piece 15 is protruded on one flank edge of the main body 14, which is interlinked with the connected part 13, of one of terminals while a protruded piece 16 is provided on the other flank edge, and they are positioned on the same level. Also, the main body 17 of the other terminal 12 is punched out in an inverted L-shape, and an element pinching piece 18 is protruded to the upper horizontal part facing the side of the protruded piece 16. The terminal is constituted as above, one pinching piece 15 is bent and opposed to the other pinching piece 18, an electronic part such as vibrating element 19 and the like is pinched in the gap generated between them and they are assembled in a case.
JP8854881A 1981-06-08 1981-06-08 Manufacture of electronic part terminal Pending JPS57202790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8854881A JPS57202790A (en) 1981-06-08 1981-06-08 Manufacture of electronic part terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8854881A JPS57202790A (en) 1981-06-08 1981-06-08 Manufacture of electronic part terminal

Publications (1)

Publication Number Publication Date
JPS57202790A true JPS57202790A (en) 1982-12-11

Family

ID=13945904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8854881A Pending JPS57202790A (en) 1981-06-08 1981-06-08 Manufacture of electronic part terminal

Country Status (1)

Country Link
JP (1) JPS57202790A (en)

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