JPS57202748A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS57202748A
JPS57202748A JP8670881A JP8670881A JPS57202748A JP S57202748 A JPS57202748 A JP S57202748A JP 8670881 A JP8670881 A JP 8670881A JP 8670881 A JP8670881 A JP 8670881A JP S57202748 A JPS57202748 A JP S57202748A
Authority
JP
Japan
Prior art keywords
wire
arm
cam
solenoid
switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8670881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229899B2 (https=
Inventor
Kazuya Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8670881A priority Critical patent/JPS57202748A/ja
Publication of JPS57202748A publication Critical patent/JPS57202748A/ja
Publication of JPS6229899B2 publication Critical patent/JPS6229899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP8670881A 1981-06-05 1981-06-05 Wire bonding device Granted JPS57202748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8670881A JPS57202748A (en) 1981-06-05 1981-06-05 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8670881A JPS57202748A (en) 1981-06-05 1981-06-05 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS57202748A true JPS57202748A (en) 1982-12-11
JPS6229899B2 JPS6229899B2 (https=) 1987-06-29

Family

ID=13894412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8670881A Granted JPS57202748A (en) 1981-06-05 1981-06-05 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS57202748A (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56112736A (en) * 1980-02-12 1981-09-05 Mitsubishi Electric Corp Semiconductor assembling apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56112736A (en) * 1980-02-12 1981-09-05 Mitsubishi Electric Corp Semiconductor assembling apparatus

Also Published As

Publication number Publication date
JPS6229899B2 (https=) 1987-06-29

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