JPS57107052A - Scribing device - Google Patents

Scribing device

Info

Publication number
JPS57107052A
JPS57107052A JP18473580A JP18473580A JPS57107052A JP S57107052 A JPS57107052 A JP S57107052A JP 18473580 A JP18473580 A JP 18473580A JP 18473580 A JP18473580 A JP 18473580A JP S57107052 A JPS57107052 A JP S57107052A
Authority
JP
Japan
Prior art keywords
cutter
wafer
spring
force
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18473580A
Other languages
Japanese (ja)
Other versions
JPS6048102B2 (en
Inventor
Toshiaki Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55184735A priority Critical patent/JPS6048102B2/en
Publication of JPS57107052A publication Critical patent/JPS57107052A/en
Publication of JPS6048102B2 publication Critical patent/JPS6048102B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

PURPOSE:To enable mechanizing of a cutting process for a laser wafer, by a method wherein a pressing member provided with an adjusting member is mounted at a support arm moving in a manner to hold a diamond cutter, and a pressing force is regulated corresponding to a cutting region. CONSTITUTION:A wafer 1 is securely sucked to a table 2 by means of a vacuum chuck 2b. A cutter supporting member 5 is installed to a support axle 4 through a support arm 7 and a spring 6, a press force is exerted on a diamond cutter through the adjustment of a spring 9, and the wafer 1 is scribed through the movement of a guide 3. Through the installation of an electromagnet 10 at the support axle 4, a force in a reverse direction to that of the spring 9 is exerted at an energizing time, and this permits a cutter 8 to be reduced in the press force. In case a GaAs laser wafer, formed in a mesa stripe structure and having a luminous region A, is cut, the press force is caused to decrease through the operation of the electromagnet 10 at a point of time when the cutter 8 passes through the luminous region A. This permits laser wafer cutting to be mechanized and mass-produced.
JP55184735A 1980-12-25 1980-12-25 scribing equipment Expired JPS6048102B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55184735A JPS6048102B2 (en) 1980-12-25 1980-12-25 scribing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55184735A JPS6048102B2 (en) 1980-12-25 1980-12-25 scribing equipment

Publications (2)

Publication Number Publication Date
JPS57107052A true JPS57107052A (en) 1982-07-03
JPS6048102B2 JPS6048102B2 (en) 1985-10-25

Family

ID=16158441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55184735A Expired JPS6048102B2 (en) 1980-12-25 1980-12-25 scribing equipment

Country Status (1)

Country Link
JP (1) JPS6048102B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914815A (en) * 1988-02-23 1990-04-10 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing hybrid integrated circuits
US8348115B2 (en) 2002-11-06 2013-01-08 Mitsuboshi Diamond Industrial Co., Ltd. Scribe line forming device and scribe line forming method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3928552A4 (en) * 2019-02-18 2023-02-22 Nokia Technologies Oy Method and apparatus for handling packet delay budget division and quality of service monitoring in a communication system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914815A (en) * 1988-02-23 1990-04-10 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing hybrid integrated circuits
US8348115B2 (en) 2002-11-06 2013-01-08 Mitsuboshi Diamond Industrial Co., Ltd. Scribe line forming device and scribe line forming method

Also Published As

Publication number Publication date
JPS6048102B2 (en) 1985-10-25

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