JPS57201846U - - Google Patents

Info

Publication number
JPS57201846U
JPS57201846U JP8987381U JP8987381U JPS57201846U JP S57201846 U JPS57201846 U JP S57201846U JP 8987381 U JP8987381 U JP 8987381U JP 8987381 U JP8987381 U JP 8987381U JP S57201846 U JPS57201846 U JP S57201846U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8987381U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8987381U priority Critical patent/JPS57201846U/ja
Publication of JPS57201846U publication Critical patent/JPS57201846U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP8987381U 1981-06-18 1981-06-18 Pending JPS57201846U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8987381U JPS57201846U (enExample) 1981-06-18 1981-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8987381U JPS57201846U (enExample) 1981-06-18 1981-06-18

Publications (1)

Publication Number Publication Date
JPS57201846U true JPS57201846U (enExample) 1982-12-22

Family

ID=29885007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8987381U Pending JPS57201846U (enExample) 1981-06-18 1981-06-18

Country Status (1)

Country Link
JP (1) JPS57201846U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178208A (ja) * 2015-03-20 2016-10-06 日本電気株式会社 ヒートシンク、放熱構造、冷却構造及び装置
JP2023140154A (ja) * 2022-03-22 2023-10-04 大日本印刷株式会社 半導体装置及び実装基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178208A (ja) * 2015-03-20 2016-10-06 日本電気株式会社 ヒートシンク、放熱構造、冷却構造及び装置
JP2023140154A (ja) * 2022-03-22 2023-10-04 大日本印刷株式会社 半導体装置及び実装基板

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