JPS57201168A - Automatic grinder for thin fragile wafer - Google Patents

Automatic grinder for thin fragile wafer

Info

Publication number
JPS57201168A
JPS57201168A JP57084679A JP8467982A JPS57201168A JP S57201168 A JPS57201168 A JP S57201168A JP 57084679 A JP57084679 A JP 57084679A JP 8467982 A JP8467982 A JP 8467982A JP S57201168 A JPS57201168 A JP S57201168A
Authority
JP
Japan
Prior art keywords
automatic grinder
thin fragile
fragile wafer
wafer
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57084679A
Other languages
English (en)
Japanese (ja)
Inventor
Guriseru Riyushian
Buradon Gaburieru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PROCEDES EQUIP SCIENCES IND
Purosede E Ekipuman Puuru Re Shiansu E Randeyusutori SA Pe Eru E Esu I
Original Assignee
PROCEDES EQUIP SCIENCES IND
Purosede E Ekipuman Puuru Re Shiansu E Randeyusutori SA Pe Eru E Esu I
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PROCEDES EQUIP SCIENCES IND, Purosede E Ekipuman Puuru Re Shiansu E Randeyusutori SA Pe Eru E Esu I filed Critical PROCEDES EQUIP SCIENCES IND
Publication of JPS57201168A publication Critical patent/JPS57201168A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP57084679A 1981-05-18 1982-05-18 Automatic grinder for thin fragile wafer Pending JPS57201168A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8110183A FR2505712A1 (fr) 1981-05-18 1981-05-18 Machine a polir automatique, pour plaquettes minces, fragiles et deformables

Publications (1)

Publication Number Publication Date
JPS57201168A true JPS57201168A (en) 1982-12-09

Family

ID=9258757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084679A Pending JPS57201168A (en) 1981-05-18 1982-05-18 Automatic grinder for thin fragile wafer

Country Status (2)

Country Link
JP (1) JPS57201168A (en:Method)
FR (1) FR2505712A1 (en:Method)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4653231A (en) * 1985-11-01 1987-03-31 Motorola, Inc. Polishing system with underwater Bernoulli pickup
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
US5885138A (en) 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US5830045A (en) 1995-08-21 1998-11-03 Ebara Corporation Polishing apparatus
FR2843320B1 (fr) * 2002-08-12 2005-05-06 Procedes & Equipement Pour Les Dispositif de preparation d'echantillons metallographiques automatique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1238802B (de) * 1963-12-18 1967-04-13 Wilhelm Loh K G Optikmaschinen Beschickungseinrichtung an Linsenschleif-, insbesondere Linsenrandschleifmaschinen
US3680267A (en) * 1971-02-18 1972-08-01 Carmet Co Workpiece loading and unloading method and apparatus
US3841028A (en) * 1972-08-24 1974-10-15 Crane Packing Co Apparatus for handling workpieces to be polished
US4062463A (en) * 1976-05-11 1977-12-13 Machine Technology, Inc. Automated single cassette load mechanism for scrubber
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus

Also Published As

Publication number Publication date
FR2505712A1 (fr) 1982-11-19
FR2505712B1 (en:Method) 1985-01-11

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