JPS57200925A - Working method for tape contacting surface - Google Patents
Working method for tape contacting surfaceInfo
- Publication number
- JPS57200925A JPS57200925A JP8572581A JP8572581A JPS57200925A JP S57200925 A JPS57200925 A JP S57200925A JP 8572581 A JP8572581 A JP 8572581A JP 8572581 A JP8572581 A JP 8572581A JP S57200925 A JPS57200925 A JP S57200925A
- Authority
- JP
- Japan
- Prior art keywords
- contacting surface
- work
- tape contacting
- parts
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
- G11B5/1871—Shaping or contouring of the transducing or guiding surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Abstract
PURPOSE:To remove the work strain of a core and to improve the work precision of a tape contacting surface, by leaving the circumference of the core gap of the tape contacting surface as a projecting part by grinding work. CONSTITUTION:The tape contacting surface 5 of a head 2 is ground by a grinding stone 10 having recessed parts 11. Through this grinding work, the tape contacting surface 5 is formed into a nearly final profile, but only the circumferences of core gap parts are left as projecting parts 9 which correspond to the recessed parts 11 in the grinding surface. Those projecting parts 9 have, for example, about 10mum height and about 350mum width. Then, lapping work which uses fixed abrasive grains and free abrasive grains is carried out to remove the projecting parts 9, thus finishing the surace into a smooth tape contacting surface. The lapped areas are limited nearly to the projecting parts 9, so the work time is shortened and the work precision of the entire tape contacting surface 5 is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8572581A JPS57200925A (en) | 1981-06-05 | 1981-06-05 | Working method for tape contacting surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8572581A JPS57200925A (en) | 1981-06-05 | 1981-06-05 | Working method for tape contacting surface |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57200925A true JPS57200925A (en) | 1982-12-09 |
JPH0145136B2 JPH0145136B2 (en) | 1989-10-02 |
Family
ID=13866815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8572581A Granted JPS57200925A (en) | 1981-06-05 | 1981-06-05 | Working method for tape contacting surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57200925A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0818311B2 (en) * | 1991-08-28 | 1996-02-28 | 北海道農材工業株式会社 | Method for manufacturing tiles for tile walls |
-
1981
- 1981-06-05 JP JP8572581A patent/JPS57200925A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0145136B2 (en) | 1989-10-02 |
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