JPS57200561A - Magnetron spattering apparatus - Google Patents

Magnetron spattering apparatus

Info

Publication number
JPS57200561A
JPS57200561A JP8445081A JP8445081A JPS57200561A JP S57200561 A JPS57200561 A JP S57200561A JP 8445081 A JP8445081 A JP 8445081A JP 8445081 A JP8445081 A JP 8445081A JP S57200561 A JPS57200561 A JP S57200561A
Authority
JP
Japan
Prior art keywords
resin
magnets
target
cooling water
corrosion resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8445081A
Other languages
Japanese (ja)
Inventor
Hiroaki Wakamatsu
Masaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8445081A priority Critical patent/JPS57200561A/en
Publication of JPS57200561A publication Critical patent/JPS57200561A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering

Abstract

PURPOSE:To prevent the effect of a magnetron from being reduced due to corrosion of magnets, by coating the surfaces of magnets of a target which will become in contact with cooling water with a corrosion resistant metal or resin film. CONSTITUTION:The surfaces of cooling water channels 3 of the magents 1 of the target 2 are coated with a corrosion resistant metal of resin film. As a metal used will be suitably mentioned Ti, Cr, Au, Rh, Pt, Pb, etc., and as a resin used will be suitably mentioned a phenol resin, urea resin, melamine resin, epoxy resin, vinyl chloride resin, fulorine plastic, urethane resin, etc.
JP8445081A 1981-06-03 1981-06-03 Magnetron spattering apparatus Pending JPS57200561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8445081A JPS57200561A (en) 1981-06-03 1981-06-03 Magnetron spattering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8445081A JPS57200561A (en) 1981-06-03 1981-06-03 Magnetron spattering apparatus

Publications (1)

Publication Number Publication Date
JPS57200561A true JPS57200561A (en) 1982-12-08

Family

ID=13830946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8445081A Pending JPS57200561A (en) 1981-06-03 1981-06-03 Magnetron spattering apparatus

Country Status (1)

Country Link
JP (1) JPS57200561A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088511A (en) * 2006-12-20 2007-04-05 Neomax Co Ltd Manufacturing method of magnetic circuit
CN109778127A (en) * 2017-11-13 2019-05-21 佳能特机株式会社 Sputtering equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088511A (en) * 2006-12-20 2007-04-05 Neomax Co Ltd Manufacturing method of magnetic circuit
CN109778127A (en) * 2017-11-13 2019-05-21 佳能特机株式会社 Sputtering equipment
CN109778127B (en) * 2017-11-13 2022-10-21 佳能特机株式会社 Sputtering device

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