JPS57193095A - Copper foil for printed circuit and method of producing same - Google Patents
Copper foil for printed circuit and method of producing sameInfo
- Publication number
- JPS57193095A JPS57193095A JP7805481A JP7805481A JPS57193095A JP S57193095 A JPS57193095 A JP S57193095A JP 7805481 A JP7805481 A JP 7805481A JP 7805481 A JP7805481 A JP 7805481A JP S57193095 A JPS57193095 A JP S57193095A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- copper foil
- producing same
- producing
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 239000011889 copper foil Substances 0.000 title 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7805481A JPS57193095A (en) | 1981-05-25 | 1981-05-25 | Copper foil for printed circuit and method of producing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7805481A JPS57193095A (en) | 1981-05-25 | 1981-05-25 | Copper foil for printed circuit and method of producing same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57193095A true JPS57193095A (en) | 1982-11-27 |
JPS6256678B2 JPS6256678B2 (enrdf_load_stackoverflow) | 1987-11-26 |
Family
ID=13651132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7805481A Granted JPS57193095A (en) | 1981-05-25 | 1981-05-25 | Copper foil for printed circuit and method of producing same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57193095A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5366814A (en) * | 1992-11-19 | 1994-11-22 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits and process for producing the same |
JP2011528406A (ja) * | 2008-07-15 | 2011-11-17 | エントン インコーポレイテッド | 銅層のガルバニック堆積のための無シアン化物電解質組成物 |
WO2017026500A1 (ja) * | 2015-08-12 | 2017-02-16 | 古河電気工業株式会社 | 表面処理銅箔及びこれを用いて製造される銅張積層板又はプリント配線板 |
-
1981
- 1981-05-25 JP JP7805481A patent/JPS57193095A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5366814A (en) * | 1992-11-19 | 1994-11-22 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits and process for producing the same |
JP2011528406A (ja) * | 2008-07-15 | 2011-11-17 | エントン インコーポレイテッド | 銅層のガルバニック堆積のための無シアン化物電解質組成物 |
WO2017026500A1 (ja) * | 2015-08-12 | 2017-02-16 | 古河電気工業株式会社 | 表面処理銅箔及びこれを用いて製造される銅張積層板又はプリント配線板 |
JPWO2017026500A1 (ja) * | 2015-08-12 | 2017-08-10 | 古河電気工業株式会社 | 表面処理銅箔及びこれを用いて製造される銅張積層板又はプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
JPS6256678B2 (enrdf_load_stackoverflow) | 1987-11-26 |
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