JPS57187668A - Wiring method for printed-wiring plate - Google Patents

Wiring method for printed-wiring plate

Info

Publication number
JPS57187668A
JPS57187668A JP56072752A JP7275281A JPS57187668A JP S57187668 A JPS57187668 A JP S57187668A JP 56072752 A JP56072752 A JP 56072752A JP 7275281 A JP7275281 A JP 7275281A JP S57187668 A JPS57187668 A JP S57187668A
Authority
JP
Japan
Prior art keywords
pattern
wiring
plate
printed
disconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56072752A
Other languages
Japanese (ja)
Inventor
Koji Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56072752A priority Critical patent/JPS57187668A/en
Publication of JPS57187668A publication Critical patent/JPS57187668A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

PURPOSE:To obtain a wiring method enabling detection of a position of disconnection of a wiring pattern caused by microcracks or the like, by measuring an electrostatic capacitance between the wiring pattern and an earth pattern provided opposite to and directly below the wiring pattern. CONSTITUTION:A wiring pattern 2 is printed on a ceramic gase plate 5, while an earth pattern 3 is provided in an intermediate layer of the plate 5, in a position opposite to and just below the pattern 2. When disconnection of the pattern 2 is confirmed between terminals A and B, for instance, electrostatic capacitances C1 and C2 between the pattern 3 and the terminals A and B are measured. Then, the position of a disconnected place 8 is decided by comparing the capacitance C1 with C2 whose sum is constant because the width, thickness, etc. of the pattern 2 are constant, and thus a wiring method for a printed-wiring plate enabling detection of the position of disconnection of the wiring pattern caused by microcracks or the like is obtained.
JP56072752A 1981-05-14 1981-05-14 Wiring method for printed-wiring plate Pending JPS57187668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56072752A JPS57187668A (en) 1981-05-14 1981-05-14 Wiring method for printed-wiring plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56072752A JPS57187668A (en) 1981-05-14 1981-05-14 Wiring method for printed-wiring plate

Publications (1)

Publication Number Publication Date
JPS57187668A true JPS57187668A (en) 1982-11-18

Family

ID=13498392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56072752A Pending JPS57187668A (en) 1981-05-14 1981-05-14 Wiring method for printed-wiring plate

Country Status (1)

Country Link
JP (1) JPS57187668A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006162525A (en) * 2004-12-10 2006-06-22 Hioki Ee Corp Circuit board inspection apparatus and circuit board inspection method
CN109557448A (en) * 2017-09-25 2019-04-02 日本电产理德股份有限公司 Base board checking device and substrate inspecting method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006162525A (en) * 2004-12-10 2006-06-22 Hioki Ee Corp Circuit board inspection apparatus and circuit board inspection method
CN109557448A (en) * 2017-09-25 2019-04-02 日本电产理德股份有限公司 Base board checking device and substrate inspecting method
KR20190035510A (en) * 2017-09-25 2019-04-03 니혼덴산리드가부시키가이샤 Substrate inspection apparatus and substrate inspection method
JP2019060627A (en) * 2017-09-25 2019-04-18 日本電産リード株式会社 Substrate inspection apparatus and substrate inspection method
TWI816699B (en) * 2017-09-25 2023-10-01 日商日本電產理德股份有限公司 Substrate inspection device and substrate inspection method
TWI873800B (en) * 2017-09-25 2025-02-21 日商日本電產理德股份有限公司 Substrate inspection device and substrate inspection method

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