JPS5718717B2 - - Google Patents

Info

Publication number
JPS5718717B2
JPS5718717B2 JP14904075A JP14904075A JPS5718717B2 JP S5718717 B2 JPS5718717 B2 JP S5718717B2 JP 14904075 A JP14904075 A JP 14904075A JP 14904075 A JP14904075 A JP 14904075A JP S5718717 B2 JPS5718717 B2 JP S5718717B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14904075A
Other languages
Japanese (ja)
Other versions
JPS5185680A (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5185680A publication Critical patent/JPS5185680A/ja
Publication of JPS5718717B2 publication Critical patent/JPS5718717B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
JP14904075A 1974-12-13 1975-12-13 Expired JPS5718717B2 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7441129A FR2294544A1 (fr) 1974-12-13 1974-12-13 Procede de fabrication, en circuit integre, de transistors a effet de champ destines a fonctionner en tres haute frequence, et structure ou dispositifs obtenus

Publications (2)

Publication Number Publication Date
JPS5185680A JPS5185680A (https=) 1976-07-27
JPS5718717B2 true JPS5718717B2 (https=) 1982-04-17

Family

ID=9146137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14904075A Expired JPS5718717B2 (https=) 1974-12-13 1975-12-13

Country Status (5)

Country Link
US (1) US4004341A (https=)
JP (1) JPS5718717B2 (https=)
DE (1) DE2556038C2 (https=)
FR (1) FR2294544A1 (https=)
GB (1) GB1530145A (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4214966A (en) * 1979-03-20 1980-07-29 Bell Telephone Laboratories, Incorporated Process useful in the fabrication of articles with metallized surfaces
FR2461358A1 (fr) * 1979-07-06 1981-01-30 Thomson Csf Procede de realisation d'un transistor a effet de champ a grille auto-alignee, et transistor obtenu par ce procede
JPS5718324A (en) * 1980-07-07 1982-01-30 Mitsubishi Electric Corp Method of working
US4325181A (en) * 1980-12-17 1982-04-20 The United States Of America As Represented By The Secretary Of The Navy Simplified fabrication method for high-performance FET
US4453305A (en) * 1981-07-31 1984-06-12 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Method for producing a MISFET
GB2133621B (en) * 1983-01-11 1987-02-04 Emi Ltd Junction field effect transistor
US4692998A (en) * 1985-01-12 1987-09-15 M/A-Com, Inc. Process for fabricating semiconductor components
US5006914A (en) * 1988-12-02 1991-04-09 Advanced Technology Materials, Inc. Single crystal semiconductor substrate articles and semiconductor devices comprising same
DE59010851D1 (de) * 1989-04-27 1998-11-12 Max Planck Gesellschaft Halbleiterstruktur mit einer 2D-Ladungsträgerschicht und Herstellungsverfahren
US5385865A (en) * 1990-04-26 1995-01-31 Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften Method of generating active semiconductor structures by means of starting structures which have a 2D charge carrier layer parallel to the surface
US5185293A (en) * 1992-04-10 1993-02-09 Eastman Kodak Company Method of forming and aligning patterns in deposted overlaying on GaAs
US5585655A (en) * 1994-08-22 1996-12-17 Matsushita Electric Industrial Co., Ltd. Field-effect transistor and method of manufacturing the same
US6811853B1 (en) 2000-03-06 2004-11-02 Shipley Company, L.L.C. Single mask lithographic process for patterning multiple types of surface features
US6627096B2 (en) 2000-05-02 2003-09-30 Shipley Company, L.L.C. Single mask technique for making positive and negative micromachined features on a substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3330696A (en) * 1967-07-11 Method of fabricating thin film capacitors
US3498833A (en) * 1966-07-08 1970-03-03 Fairchild Camera Instr Co Double masking technique for integrated circuit
US3574010A (en) * 1968-12-30 1971-04-06 Texas Instruments Inc Fabrication of metal insulator semiconductor field effect transistors
FR2104704B1 (https=) * 1970-08-07 1973-11-23 Thomson Csf
JPS4839178A (https=) * 1971-09-22 1973-06-08
FR2157740B1 (https=) * 1971-10-29 1976-10-29 Thomson Csf
JPS48100078A (https=) * 1972-03-29 1973-12-18
US3875656A (en) * 1973-07-25 1975-04-08 Motorola Inc Fabrication technique for high density integrated circuits

Also Published As

Publication number Publication date
GB1530145A (en) 1978-10-25
JPS5185680A (https=) 1976-07-27
US4004341A (en) 1977-01-25
FR2294544B1 (https=) 1978-06-23
DE2556038C2 (de) 1983-07-28
FR2294544A1 (fr) 1976-07-09
DE2556038A1 (de) 1976-06-16

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