JPS57179705A - Method and device for measuring thickness of alloy plating - Google Patents

Method and device for measuring thickness of alloy plating

Info

Publication number
JPS57179705A
JPS57179705A JP6586281A JP6586281A JPS57179705A JP S57179705 A JPS57179705 A JP S57179705A JP 6586281 A JP6586281 A JP 6586281A JP 6586281 A JP6586281 A JP 6586281A JP S57179705 A JPS57179705 A JP S57179705A
Authority
JP
Japan
Prior art keywords
rays
fluorescent
plating
thickness
radiated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6586281A
Other languages
Japanese (ja)
Inventor
Masakatsu Fujino
Yoshiro Matsumoto
Hiroshi Ishijima
Minoru Handa
Yoshio Uto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Nippon Steel Corp
Original Assignee
Seiko Instruments Inc
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc, Sumitomo Metal Industries Ltd filed Critical Seiko Instruments Inc
Priority to JP6586281A priority Critical patent/JPS57179705A/en
Publication of JPS57179705A publication Critical patent/JPS57179705A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

PURPOSE:To make the accurate measurement of the thickness of alloy plating without contact possible by separating the fluorescent X-rays radiated secondarily by X-ray irradiation to those from the underlying metal and from the plating and measuring the intensities of the respective components. CONSTITUTION:When X-rays 13 are irradiated to a steel plate 2 applied with composite plating 3 of Ni and Zn, fluorescent X-rays 14 are radiated secondarily. Since the fluorescent X-rays are radiated from Fe, Ni, Zn respectively, Fe fluorescent X-rays 14a, and Ni fluorescent X-rays 14b are extracted through a filter 15 consisting of Fe and a filter 16 consisting of Ni. The outputs D1, D2 corresponding to the intensities of the respective fluorescent X-rays are obtained from the pulses P1, P2 from ionization boxes 17, 18 and are inputted to a CPU23. From the difference in these two signals, an Ni-content data is obtained, from which the data on the intensity of the Fe fluorescent X-rays is corrected. Since the intensity of the Fe fluorescent X-rays decreases with an increase in the thickness of the plating, the thickness of the plating is operated from this relation.
JP6586281A 1981-04-30 1981-04-30 Method and device for measuring thickness of alloy plating Pending JPS57179705A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6586281A JPS57179705A (en) 1981-04-30 1981-04-30 Method and device for measuring thickness of alloy plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6586281A JPS57179705A (en) 1981-04-30 1981-04-30 Method and device for measuring thickness of alloy plating

Publications (1)

Publication Number Publication Date
JPS57179705A true JPS57179705A (en) 1982-11-05

Family

ID=13299234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6586281A Pending JPS57179705A (en) 1981-04-30 1981-04-30 Method and device for measuring thickness of alloy plating

Country Status (1)

Country Link
JP (1) JPS57179705A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61139749A (en) * 1984-12-12 1986-06-27 Seiko Instr & Electronics Ltd Alloy plating adhesion amount meter
JPS61283859A (en) * 1985-06-08 1986-12-13 Horiba Ltd Detector for nickel and vanadium in oil

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57172207A (en) * 1981-04-16 1982-10-23 Seiko Instr & Electronics Ltd Measuring method for plating thickness by x rays

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57172207A (en) * 1981-04-16 1982-10-23 Seiko Instr & Electronics Ltd Measuring method for plating thickness by x rays

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61139749A (en) * 1984-12-12 1986-06-27 Seiko Instr & Electronics Ltd Alloy plating adhesion amount meter
JPS61283859A (en) * 1985-06-08 1986-12-13 Horiba Ltd Detector for nickel and vanadium in oil

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