JPS57178732A - Molding method for filler-containing low molecular weight thermoplastic resin composition - Google Patents

Molding method for filler-containing low molecular weight thermoplastic resin composition

Info

Publication number
JPS57178732A
JPS57178732A JP56062768A JP6276881A JPS57178732A JP S57178732 A JPS57178732 A JP S57178732A JP 56062768 A JP56062768 A JP 56062768A JP 6276881 A JP6276881 A JP 6276881A JP S57178732 A JPS57178732 A JP S57178732A
Authority
JP
Japan
Prior art keywords
blend
molecular weight
powder
thermoplastic resin
low molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56062768A
Other languages
Japanese (ja)
Inventor
Takashi Kobayashi
Osamu Amano
Sakuya Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Oil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Oil Corp filed Critical Nippon Oil Corp
Priority to JP56062768A priority Critical patent/JPS57178732A/en
Publication of JPS57178732A publication Critical patent/JPS57178732A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To obtain a colored molded product having no discolored part by injecting once a dry blended mixture of a powder inorganic filler and a powder low molecular weight thermoplastic resin directly by a heat plasticizer through a cooled material supplying unit. CONSTITUTION:A powder blend 11 of 90-50wt% of powder inorganic filler such as clay and 10-50wt% of powder low molecular weight thermoplastic resin such as polyethylene having mean molecular weight of 200-3,000 or the like is supplied to an agitating hopper 1 of a material supplying unit A, and the blend is supplied each in the prescribed amount in numelted state to the material supply port 18 of a heat plasticizer B while cooling and agitating the blend with an inner screw 12. The supplied blend 11 is then melted by a heater 4 of the plasticizer B. The blend is kneaded and fed simultaneously from a compression section 6 of the screw 13 to a weighing section 7, and a completely homogenious melted mixture is produced in a heating cylindrical head 8. This mixture is injected into a mold 10.
JP56062768A 1981-04-25 1981-04-25 Molding method for filler-containing low molecular weight thermoplastic resin composition Pending JPS57178732A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56062768A JPS57178732A (en) 1981-04-25 1981-04-25 Molding method for filler-containing low molecular weight thermoplastic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56062768A JPS57178732A (en) 1981-04-25 1981-04-25 Molding method for filler-containing low molecular weight thermoplastic resin composition

Publications (1)

Publication Number Publication Date
JPS57178732A true JPS57178732A (en) 1982-11-04

Family

ID=13209889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56062768A Pending JPS57178732A (en) 1981-04-25 1981-04-25 Molding method for filler-containing low molecular weight thermoplastic resin composition

Country Status (1)

Country Link
JP (1) JPS57178732A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978558A (en) * 1988-06-10 1990-12-18 United Technologies Corporation Method for applying diffusion coating masks
WO1996034160A1 (en) * 1995-04-24 1996-10-31 Owens Corning Shingle of resinous material and filler
WO1996034162A1 (en) * 1995-04-24 1996-10-31 Owens Corning A roof containing resinous material and filler
WO2001096085A3 (en) * 2000-06-15 2002-06-13 Quantum Composites Inc Process of injection molding highly conductive resin compositions and apparatus for that
WO2002070224A1 (en) * 2001-02-12 2002-09-12 Pactiv Corporation Injection-molded, mineral-filled articles and processes for making the same
US6752937B2 (en) 2001-12-17 2004-06-22 Quantum Composites, Inc. Highly conductive molding compounds having an increased distribution of large size graphite particles
KR100800269B1 (en) 2006-11-23 2008-02-05 상신브레이크주식회사 Drying and mixing device of material supplier for automobile brake pad forming

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627336A (en) * 1979-08-13 1981-03-17 Nippon Oil Co Ltd Injection molding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627336A (en) * 1979-08-13 1981-03-17 Nippon Oil Co Ltd Injection molding method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978558A (en) * 1988-06-10 1990-12-18 United Technologies Corporation Method for applying diffusion coating masks
WO1996034160A1 (en) * 1995-04-24 1996-10-31 Owens Corning Shingle of resinous material and filler
WO1996034162A1 (en) * 1995-04-24 1996-10-31 Owens Corning A roof containing resinous material and filler
WO2001096085A3 (en) * 2000-06-15 2002-06-13 Quantum Composites Inc Process of injection molding highly conductive resin compositions and apparatus for that
WO2002070224A1 (en) * 2001-02-12 2002-09-12 Pactiv Corporation Injection-molded, mineral-filled articles and processes for making the same
US6752937B2 (en) 2001-12-17 2004-06-22 Quantum Composites, Inc. Highly conductive molding compounds having an increased distribution of large size graphite particles
KR100800269B1 (en) 2006-11-23 2008-02-05 상신브레이크주식회사 Drying and mixing device of material supplier for automobile brake pad forming

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