JPS57176172A - Manufacture of printed circuit board - Google Patents

Manufacture of printed circuit board

Info

Publication number
JPS57176172A
JPS57176172A JP6199581A JP6199581A JPS57176172A JP S57176172 A JPS57176172 A JP S57176172A JP 6199581 A JP6199581 A JP 6199581A JP 6199581 A JP6199581 A JP 6199581A JP S57176172 A JPS57176172 A JP S57176172A
Authority
JP
Japan
Prior art keywords
ink
nozzle
powders
caused
dissoluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6199581A
Other languages
Japanese (ja)
Inventor
Junichi Honma
Nobuo Oide
Fumitake Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6199581A priority Critical patent/JPS57176172A/en
Publication of JPS57176172A publication Critical patent/JPS57176172A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Abstract

PURPOSE:To easily manufacture printed circuit boards at a low manufacturing cost with less number of manufacturing stage used by jetting out small droplets of a kind of ink which contains a specific heat dissoluble medium and powders of electroconductive substance, etc. through a nozzle. CONSTITUTION:An ink to be used contains a heat dissoluble medium which dissolves at a temperature higher than 40 deg.C and becomes liquid and powders of electroconductive substance such as gold, silver, copper etc. or powders of resistive substance such as silver-palladium, etc. This ink is maintained at a low viscosity by a nozzle 2 of an ink droplet jetting device which is heated and small droplets of ink are caused to jet out and fly continuously from the nozzle 2 at a fixed generating cycle, while a nozzle scanning unit 8, that is the nozzle 2, is caused to move by the operation of a control unit 9 so that it draws a desired circuit pattern. In sequence, ink droplets 6 are caused to adhere to the surface of a substrate 11 so that they are arranged at a fixed arrangement density and connected together to form a continuous line and a desired circuit pattern 12 is formed on the substrate 11.
JP6199581A 1981-04-24 1981-04-24 Manufacture of printed circuit board Pending JPS57176172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6199581A JPS57176172A (en) 1981-04-24 1981-04-24 Manufacture of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6199581A JPS57176172A (en) 1981-04-24 1981-04-24 Manufacture of printed circuit board

Publications (1)

Publication Number Publication Date
JPS57176172A true JPS57176172A (en) 1982-10-29

Family

ID=13187287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6199581A Pending JPS57176172A (en) 1981-04-24 1981-04-24 Manufacture of printed circuit board

Country Status (1)

Country Link
JP (1) JPS57176172A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03122548A (en) * 1989-10-04 1991-05-24 Canon Inc Apparatus and method of separating grain, and measuring apparatus of grain using the same
US6328421B1 (en) 1995-08-22 2001-12-11 Nec Corporation Fluid drop projecting head using taper-shaped chamber for generating a converging surface wave
US6450615B2 (en) 1997-02-19 2002-09-17 Nec Corporation Ink jet printing apparatus and method using a pressure generating device to induce surface waves in an ink meniscus
US6519824B2 (en) * 2000-03-24 2003-02-18 Olympus Optical Co., Ltd. Electric wiring forming system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03122548A (en) * 1989-10-04 1991-05-24 Canon Inc Apparatus and method of separating grain, and measuring apparatus of grain using the same
US6328421B1 (en) 1995-08-22 2001-12-11 Nec Corporation Fluid drop projecting head using taper-shaped chamber for generating a converging surface wave
US6450615B2 (en) 1997-02-19 2002-09-17 Nec Corporation Ink jet printing apparatus and method using a pressure generating device to induce surface waves in an ink meniscus
US6519824B2 (en) * 2000-03-24 2003-02-18 Olympus Optical Co., Ltd. Electric wiring forming system

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