JPS57170561U - - Google Patents

Info

Publication number
JPS57170561U
JPS57170561U JP1981058020U JP5802081U JPS57170561U JP S57170561 U JPS57170561 U JP S57170561U JP 1981058020 U JP1981058020 U JP 1981058020U JP 5802081 U JP5802081 U JP 5802081U JP S57170561 U JPS57170561 U JP S57170561U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981058020U
Other languages
Japanese (ja)
Other versions
JPS6223096Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981058020U priority Critical patent/JPS6223096Y2/ja
Publication of JPS57170561U publication Critical patent/JPS57170561U/ja
Application granted granted Critical
Publication of JPS6223096Y2 publication Critical patent/JPS6223096Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1981058020U 1981-04-20 1981-04-20 Expired JPS6223096Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981058020U JPS6223096Y2 (enrdf_load_stackoverflow) 1981-04-20 1981-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981058020U JPS6223096Y2 (enrdf_load_stackoverflow) 1981-04-20 1981-04-20

Publications (2)

Publication Number Publication Date
JPS57170561U true JPS57170561U (enrdf_load_stackoverflow) 1982-10-27
JPS6223096Y2 JPS6223096Y2 (enrdf_load_stackoverflow) 1987-06-12

Family

ID=29854459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981058020U Expired JPS6223096Y2 (enrdf_load_stackoverflow) 1981-04-20 1981-04-20

Country Status (1)

Country Link
JP (1) JPS6223096Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252159A (ja) * 1986-04-25 1987-11-02 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPWO2016016985A1 (ja) * 2014-07-31 2017-04-27 三菱電機株式会社 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038257U (enrdf_load_stackoverflow) * 1973-08-06 1975-04-21
JPS51131174U (enrdf_load_stackoverflow) * 1975-04-15 1976-10-22
JPS5216864U (enrdf_load_stackoverflow) * 1975-07-22 1977-02-05

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038257U (enrdf_load_stackoverflow) * 1973-08-06 1975-04-21
JPS51131174U (enrdf_load_stackoverflow) * 1975-04-15 1976-10-22
JPS5216864U (enrdf_load_stackoverflow) * 1975-07-22 1977-02-05

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252159A (ja) * 1986-04-25 1987-11-02 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPWO2016016985A1 (ja) * 2014-07-31 2017-04-27 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS6223096Y2 (enrdf_load_stackoverflow) 1987-06-12

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