JPS57168941A - Heat-resistant reinforced polyamide molding - Google Patents

Heat-resistant reinforced polyamide molding

Info

Publication number
JPS57168941A
JPS57168941A JP5437381A JP5437381A JPS57168941A JP S57168941 A JPS57168941 A JP S57168941A JP 5437381 A JP5437381 A JP 5437381A JP 5437381 A JP5437381 A JP 5437381A JP S57168941 A JPS57168941 A JP S57168941A
Authority
JP
Japan
Prior art keywords
molding
titled
blending
nylon
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5437381A
Other languages
Japanese (ja)
Inventor
Kazumasa Chiba
Toshio Muraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP5437381A priority Critical patent/JPS57168941A/en
Publication of JPS57168941A publication Critical patent/JPS57168941A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To provide the titled molding by blending and thereafter molding a mixture of a specified polyamide and an inorganic reinforcing material which exhibits a high thermal distortion temperature, good dimensional stability, and is suitable for precise machine parts or automobile parts.
CONSTITUTION: The titled molding is prepared by blending 50W90wt% polyamide (Nylon 11.6 Nylon 12.6) mainly comprising units of undecanemethylene adipamide and/or dodecamethylene adipamide prepared by polymerizing an equimolar salt of undecanemethylenediamine and/or of dodecamethylenediamine with adipic acid, respectively,and (B) 10W50wt% inorganic reinforcing agent (e.g. glass fiber, talc). The product obtained is then subjected to melt-molding (injection molding) to produce the titled moldings.
COPYRIGHT: (C)1982,JPO&Japio
JP5437381A 1981-04-13 1981-04-13 Heat-resistant reinforced polyamide molding Pending JPS57168941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5437381A JPS57168941A (en) 1981-04-13 1981-04-13 Heat-resistant reinforced polyamide molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5437381A JPS57168941A (en) 1981-04-13 1981-04-13 Heat-resistant reinforced polyamide molding

Publications (1)

Publication Number Publication Date
JPS57168941A true JPS57168941A (en) 1982-10-18

Family

ID=12968862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5437381A Pending JPS57168941A (en) 1981-04-13 1981-04-13 Heat-resistant reinforced polyamide molding

Country Status (1)

Country Link
JP (1) JPS57168941A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63270761A (en) * 1987-04-28 1988-11-08 Unitika Ltd Polyamide resin composition of good thermal conductivity
EP0691996A1 (en) * 1993-03-29 1996-01-17 E.I. Du Pont De Nemours And Company Polyamide resin composition
WO2008066763A1 (en) * 2006-11-22 2008-06-05 E. I. Du Pont De Nemours And Company Mobile telephone housing comprising polyamide resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63270761A (en) * 1987-04-28 1988-11-08 Unitika Ltd Polyamide resin composition of good thermal conductivity
EP0691996A1 (en) * 1993-03-29 1996-01-17 E.I. Du Pont De Nemours And Company Polyamide resin composition
EP0691996A4 (en) * 1993-03-29 1997-06-18 Du Pont Polyamide resin composition
WO2008066763A1 (en) * 2006-11-22 2008-06-05 E. I. Du Pont De Nemours And Company Mobile telephone housing comprising polyamide resin composition

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