JPS57160906A - Silicon carbide having metallized layer and its manufacture - Google Patents

Silicon carbide having metallized layer and its manufacture

Info

Publication number
JPS57160906A
JPS57160906A JP56046463A JP4646381A JPS57160906A JP S57160906 A JPS57160906 A JP S57160906A JP 56046463 A JP56046463 A JP 56046463A JP 4646381 A JP4646381 A JP 4646381A JP S57160906 A JPS57160906 A JP S57160906A
Authority
JP
Japan
Prior art keywords
sic
contg
melt
heating
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56046463A
Other languages
Japanese (ja)
Other versions
JPS6128632B2 (en
Inventor
Yasuo Matsushita
Tadamichi Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56046463A priority Critical patent/JPS57160906A/en
Publication of JPS57160906A publication Critical patent/JPS57160906A/en
Publication of JPS6128632B2 publication Critical patent/JPS6128632B2/ja
Granted legal-status Critical Current

Links

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  • Ceramic Products (AREA)

Abstract

PURPOSE: To form metallized layer with superior adhesion on the surface of SiC by melt-aticking a silicide forming metallic element to the SiC surface by heating.
CONSTITUTION: A metal-base mixture contg. a silicide forming metallic element or a substance contg. the element is melt-stuck to the surface of an SiC-base substance such as a sintered SiC body by heating. For examle, it is preferable that a powdered mixture of fine Cu powder with 1W40wt% as Mn of Mn powder or Mn compound powder is mixed with an org. solvent to prepare metallic paste, and the paste is applied to the surface of a sintered SiC body and melt-stuck to the surface by heating in a nonoxidizing atmosphere. Thus, a metallized film of Cu with high adhesion to an electrically insulating SiC sintered body contg. Be or a substance contg. Be can be formed.
COPYRIGHT: (C)1982,JPO&Japio
JP56046463A 1981-03-31 1981-03-31 Silicon carbide having metallized layer and its manufacture Granted JPS57160906A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56046463A JPS57160906A (en) 1981-03-31 1981-03-31 Silicon carbide having metallized layer and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56046463A JPS57160906A (en) 1981-03-31 1981-03-31 Silicon carbide having metallized layer and its manufacture

Publications (2)

Publication Number Publication Date
JPS57160906A true JPS57160906A (en) 1982-10-04
JPS6128632B2 JPS6128632B2 (en) 1986-07-01

Family

ID=12747854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56046463A Granted JPS57160906A (en) 1981-03-31 1981-03-31 Silicon carbide having metallized layer and its manufacture

Country Status (1)

Country Link
JP (1) JPS57160906A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736790Y2 (en) * 1988-05-02 1995-08-23 凸版印刷株式会社 Image forming body

Also Published As

Publication number Publication date
JPS6128632B2 (en) 1986-07-01

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