JPS57156157A - Grinding method and device - Google Patents

Grinding method and device

Info

Publication number
JPS57156157A
JPS57156157A JP56036469A JP3646981A JPS57156157A JP S57156157 A JPS57156157 A JP S57156157A JP 56036469 A JP56036469 A JP 56036469A JP 3646981 A JP3646981 A JP 3646981A JP S57156157 A JPS57156157 A JP S57156157A
Authority
JP
Japan
Prior art keywords
work
grindstone
grinding
detached
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56036469A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0212699B2 (en:Method
Inventor
Satoshi Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seiko Ltd filed Critical Hitachi Seiko Ltd
Priority to JP56036469A priority Critical patent/JPS57156157A/ja
Publication of JPS57156157A publication Critical patent/JPS57156157A/ja
Priority to US06/581,269 priority patent/US4587765A/en
Publication of JPH0212699B2 publication Critical patent/JPH0212699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP56036469A 1981-03-16 1981-03-16 Grinding method and device Granted JPS57156157A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56036469A JPS57156157A (en) 1981-03-16 1981-03-16 Grinding method and device
US06/581,269 US4587765A (en) 1981-03-16 1984-02-17 Method of an apparatus for grinding work surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56036469A JPS57156157A (en) 1981-03-16 1981-03-16 Grinding method and device

Publications (2)

Publication Number Publication Date
JPS57156157A true JPS57156157A (en) 1982-09-27
JPH0212699B2 JPH0212699B2 (en:Method) 1990-03-26

Family

ID=12470668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56036469A Granted JPS57156157A (en) 1981-03-16 1981-03-16 Grinding method and device

Country Status (2)

Country Link
US (1) US4587765A (en:Method)
JP (1) JPS57156157A (en:Method)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753049A (en) * 1984-01-23 1988-06-28 Disco Abrasive Systems, Ltd. Method and apparatus for grinding the surface of a semiconductor
JPS63185559A (ja) * 1987-01-24 1988-08-01 Nippon Telegr & Teleph Corp <Ntt> 光フアイバコネクタ端面研磨装置
JP2012081556A (ja) * 2010-10-12 2012-04-26 Disco Corp 加工装置
CN109571156A (zh) * 2019-01-24 2019-04-05 刘兴秋 一种研磨抛光机组
JP2022190858A (ja) * 2021-06-15 2022-12-27 株式会社ディスコ 被加工物の研削方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0692042B2 (ja) * 1985-05-22 1994-11-16 豊田工機株式会社 主軸装置
US5934983A (en) * 1996-04-08 1999-08-10 Kabushiki Kaisha Kobe Seiko Sho Double-side grinding method and double-side grinder
US6358851B1 (en) * 2000-04-04 2002-03-19 Taiwan Semiconductor Manufacturing Company Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
GB2373466B (en) * 2001-03-22 2004-05-19 Unova Uk Ltd Method of reducing thermal distortion in grinding machines
US20040166770A1 (en) * 2003-02-25 2004-08-26 Flasch Joseph W. Grinding apparatus and method
CN106112718A (zh) * 2016-07-01 2016-11-16 芜湖中驰机床制造有限公司 一种高精度平面磨床

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5331272A (en) * 1976-09-02 1978-03-24 Koyo Kikai Kougiyou Kk Clamp device for annular work to be plane worked
JPS55112758A (en) * 1979-02-19 1980-08-30 Hitachi Ltd Plane surface grinder

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1138683A (en) * 1912-08-05 1915-05-11 George R Murray Stone grinding and polishing machine.
US2127071A (en) * 1928-11-16 1938-08-16 Charles H Schmalz Apparatus for grinding
US2195065A (en) * 1938-11-05 1940-03-26 Chrysler Corp Finishing apparatus and method
US2370813A (en) * 1942-09-21 1945-03-06 Lawrence B Portman Grinding machine
US2629972A (en) * 1948-03-09 1953-03-03 Oliver Instr Company Grinding machine
US2612008A (en) * 1951-04-10 1952-09-30 Heald Machine Co Internal grinding machine
US2664787A (en) * 1952-02-16 1954-01-05 Cincinnati Milling Machine Co Thermal compensator
US3399498A (en) * 1965-09-15 1968-09-03 Ginori Ceramica Ital Spa Abrading apparatus for finishing plates
US3952456A (en) * 1975-02-07 1976-04-27 Oliver Instrument Company Grinding machine
US4318250A (en) * 1980-03-31 1982-03-09 St. Florian Company, Ltd. Wafer grinder
JPS56152562A (en) * 1980-04-24 1981-11-26 Fujitsu Ltd Grinder

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5331272A (en) * 1976-09-02 1978-03-24 Koyo Kikai Kougiyou Kk Clamp device for annular work to be plane worked
JPS55112758A (en) * 1979-02-19 1980-08-30 Hitachi Ltd Plane surface grinder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753049A (en) * 1984-01-23 1988-06-28 Disco Abrasive Systems, Ltd. Method and apparatus for grinding the surface of a semiconductor
JPS63185559A (ja) * 1987-01-24 1988-08-01 Nippon Telegr & Teleph Corp <Ntt> 光フアイバコネクタ端面研磨装置
JP2012081556A (ja) * 2010-10-12 2012-04-26 Disco Corp 加工装置
CN109571156A (zh) * 2019-01-24 2019-04-05 刘兴秋 一种研磨抛光机组
JP2022190858A (ja) * 2021-06-15 2022-12-27 株式会社ディスコ 被加工物の研削方法

Also Published As

Publication number Publication date
JPH0212699B2 (en:Method) 1990-03-26
US4587765A (en) 1986-05-13

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