JPS57141944A - Microwave semiconductor device - Google Patents

Microwave semiconductor device

Info

Publication number
JPS57141944A
JPS57141944A JP56027211A JP2721181A JPS57141944A JP S57141944 A JPS57141944 A JP S57141944A JP 56027211 A JP56027211 A JP 56027211A JP 2721181 A JP2721181 A JP 2721181A JP S57141944 A JPS57141944 A JP S57141944A
Authority
JP
Japan
Prior art keywords
image lines
conductor
earthing
covered
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56027211A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6363121B2 (enrdf_load_stackoverflow
Inventor
Sunao Takagi
Koji Ogiso
Fumio Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56027211A priority Critical patent/JPS57141944A/ja
Publication of JPS57141944A publication Critical patent/JPS57141944A/ja
Publication of JPS6363121B2 publication Critical patent/JPS6363121B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
JP56027211A 1981-02-26 1981-02-26 Microwave semiconductor device Granted JPS57141944A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56027211A JPS57141944A (en) 1981-02-26 1981-02-26 Microwave semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56027211A JPS57141944A (en) 1981-02-26 1981-02-26 Microwave semiconductor device

Publications (2)

Publication Number Publication Date
JPS57141944A true JPS57141944A (en) 1982-09-02
JPS6363121B2 JPS6363121B2 (enrdf_load_stackoverflow) 1988-12-06

Family

ID=12214763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56027211A Granted JPS57141944A (en) 1981-02-26 1981-02-26 Microwave semiconductor device

Country Status (1)

Country Link
JP (1) JPS57141944A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221015A (ja) * 1983-05-31 1984-12-12 Nippon Ueebu Gaido Kk 導波管形増幅器
US6236366B1 (en) 1996-09-02 2001-05-22 Olympus Optical Co., Ltd. Hermetically sealed semiconductor module composed of semiconductor integrated circuit and antenna element
JP2019013015A (ja) * 2014-10-21 2019-01-24 エイ・ティ・アンド・ティ インテレクチュアル プロパティ アイ，エル．ピー． 電磁波を伝送するための方法及び装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3034714U (ja) * 1996-08-13 1997-03-07 有限会社日医商事 間仕切り装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112753A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro
JPS5112754A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112753A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro
JPS5112754A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221015A (ja) * 1983-05-31 1984-12-12 Nippon Ueebu Gaido Kk 導波管形増幅器
US6236366B1 (en) 1996-09-02 2001-05-22 Olympus Optical Co., Ltd. Hermetically sealed semiconductor module composed of semiconductor integrated circuit and antenna element
JP2019013015A (ja) * 2014-10-21 2019-01-24 エイ・ティ・アンド・ティ インテレクチュアル プロパティ アイ，エル．ピー． 電磁波を伝送するための方法及び装置

Also Published As

Publication number Publication date
JPS6363121B2 (enrdf_load_stackoverflow) 1988-12-06

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