JPS57135744U - - Google Patents
Info
- Publication number
- JPS57135744U JPS57135744U JP1981022982U JP2298281U JPS57135744U JP S57135744 U JPS57135744 U JP S57135744U JP 1981022982 U JP1981022982 U JP 1981022982U JP 2298281 U JP2298281 U JP 2298281U JP S57135744 U JPS57135744 U JP S57135744U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981022982U JPS629723Y2 (cg-RX-API-DMAC7.html) | 1981-02-20 | 1981-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981022982U JPS629723Y2 (cg-RX-API-DMAC7.html) | 1981-02-20 | 1981-02-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57135744U true JPS57135744U (cg-RX-API-DMAC7.html) | 1982-08-24 |
| JPS629723Y2 JPS629723Y2 (cg-RX-API-DMAC7.html) | 1987-03-06 |
Family
ID=29820752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981022982U Expired JPS629723Y2 (cg-RX-API-DMAC7.html) | 1981-02-20 | 1981-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS629723Y2 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106153A (ja) * | 1983-11-15 | 1985-06-11 | Toshiba Corp | 半導体装置およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116877A (cg-RX-API-DMAC7.html) * | 1974-07-31 | 1976-02-10 | Sharp Kk | |
| JPS54141874U (cg-RX-API-DMAC7.html) * | 1978-03-24 | 1979-10-02 |
-
1981
- 1981-02-20 JP JP1981022982U patent/JPS629723Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116877A (cg-RX-API-DMAC7.html) * | 1974-07-31 | 1976-02-10 | Sharp Kk | |
| JPS54141874U (cg-RX-API-DMAC7.html) * | 1978-03-24 | 1979-10-02 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106153A (ja) * | 1983-11-15 | 1985-06-11 | Toshiba Corp | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS629723Y2 (cg-RX-API-DMAC7.html) | 1987-03-06 |