JPS57133654A - Cooling unit for wiring board - Google Patents
Cooling unit for wiring boardInfo
- Publication number
- JPS57133654A JPS57133654A JP2072581A JP2072581A JPS57133654A JP S57133654 A JPS57133654 A JP S57133654A JP 2072581 A JP2072581 A JP 2072581A JP 2072581 A JP2072581 A JP 2072581A JP S57133654 A JPS57133654 A JP S57133654A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- parts
- vessel
- sections
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To protect the wiring board from harmful environment, and to prevent parts from corrosion and abrasion by covering the wiring board, to which a plurality of electronic circuit parts are attached and wired, with a sealed vessel and mounting a means cooling the wiring board or the attached parts to the vessel. CONSTITUTION:A part unit is manufactured in such a manner that the parts 2 are mounted to the wiring board 1 and the wiring board and the parts are connected mutually by wiring formed to the wiring board 1. The wiring board 1 is sealed into the vessel 3 consisting of upper and lower two sections so that terminal sections are projected through the tightening of a packing 6 and a tightening section 5. Methods such as the following methods are executed as the cooling means for the parts 2. (1) Cooling fins 4 are shaped to the upper and lower outer wall surfaces of the vessel 3. (2) Bars 7 having excellent heat transfer property are inserted into the vessel in airtight shapes and bonded onto the upper surfaces of the parts, and fins 8 are formed to the outside sections of the vessel of the bars 7. (3) Si group compound for radiation having excellent heat transfer property or an insulator such as Si rubber is filled and positioned to the lower section or upper and lower whole sections of a space section sealed. Accordingly, the breakdown of the parts and the degradation of characteristics under the harmful environment can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2072581A JPS57133654A (en) | 1981-02-12 | 1981-02-12 | Cooling unit for wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2072581A JPS57133654A (en) | 1981-02-12 | 1981-02-12 | Cooling unit for wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57133654A true JPS57133654A (en) | 1982-08-18 |
Family
ID=12035147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2072581A Pending JPS57133654A (en) | 1981-02-12 | 1981-02-12 | Cooling unit for wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57133654A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0130279A2 (en) * | 1983-03-25 | 1985-01-09 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly for cooling electronic parts |
US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
JPH10335863A (en) * | 1997-05-28 | 1998-12-18 | Robert Bosch Gmbh | Controller |
US6949838B2 (en) | 1998-10-01 | 2005-09-27 | Micron Technology, Inc. | Integrated circuit device |
EP2055159A2 (en) * | 2006-08-18 | 2009-05-06 | Delphi Technologies Inc. | Lightweight audio system for automotive applications and method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51114879A (en) * | 1975-03-31 | 1976-10-08 | Ibm | Air cooled container actually mounted |
-
1981
- 1981-02-12 JP JP2072581A patent/JPS57133654A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51114879A (en) * | 1975-03-31 | 1976-10-08 | Ibm | Air cooled container actually mounted |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0130279A2 (en) * | 1983-03-25 | 1985-01-09 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly for cooling electronic parts |
US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
JPH10335863A (en) * | 1997-05-28 | 1998-12-18 | Robert Bosch Gmbh | Controller |
US6949838B2 (en) | 1998-10-01 | 2005-09-27 | Micron Technology, Inc. | Integrated circuit device |
EP2055159A2 (en) * | 2006-08-18 | 2009-05-06 | Delphi Technologies Inc. | Lightweight audio system for automotive applications and method |
EP2055159A4 (en) * | 2006-08-18 | 2010-12-01 | Delphi Tech Inc | Lightweight audio system for automotive applications and method |
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