JPS57133654A - Cooling unit for wiring board - Google Patents

Cooling unit for wiring board

Info

Publication number
JPS57133654A
JPS57133654A JP2072581A JP2072581A JPS57133654A JP S57133654 A JPS57133654 A JP S57133654A JP 2072581 A JP2072581 A JP 2072581A JP 2072581 A JP2072581 A JP 2072581A JP S57133654 A JPS57133654 A JP S57133654A
Authority
JP
Japan
Prior art keywords
wiring board
parts
vessel
sections
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2072581A
Other languages
Japanese (ja)
Inventor
Masao Fujii
Kazunari Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2072581A priority Critical patent/JPS57133654A/en
Publication of JPS57133654A publication Critical patent/JPS57133654A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To protect the wiring board from harmful environment, and to prevent parts from corrosion and abrasion by covering the wiring board, to which a plurality of electronic circuit parts are attached and wired, with a sealed vessel and mounting a means cooling the wiring board or the attached parts to the vessel. CONSTITUTION:A part unit is manufactured in such a manner that the parts 2 are mounted to the wiring board 1 and the wiring board and the parts are connected mutually by wiring formed to the wiring board 1. The wiring board 1 is sealed into the vessel 3 consisting of upper and lower two sections so that terminal sections are projected through the tightening of a packing 6 and a tightening section 5. Methods such as the following methods are executed as the cooling means for the parts 2. (1) Cooling fins 4 are shaped to the upper and lower outer wall surfaces of the vessel 3. (2) Bars 7 having excellent heat transfer property are inserted into the vessel in airtight shapes and bonded onto the upper surfaces of the parts, and fins 8 are formed to the outside sections of the vessel of the bars 7. (3) Si group compound for radiation having excellent heat transfer property or an insulator such as Si rubber is filled and positioned to the lower section or upper and lower whole sections of a space section sealed. Accordingly, the breakdown of the parts and the degradation of characteristics under the harmful environment can be prevented.
JP2072581A 1981-02-12 1981-02-12 Cooling unit for wiring board Pending JPS57133654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2072581A JPS57133654A (en) 1981-02-12 1981-02-12 Cooling unit for wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2072581A JPS57133654A (en) 1981-02-12 1981-02-12 Cooling unit for wiring board

Publications (1)

Publication Number Publication Date
JPS57133654A true JPS57133654A (en) 1982-08-18

Family

ID=12035147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2072581A Pending JPS57133654A (en) 1981-02-12 1981-02-12 Cooling unit for wiring board

Country Status (1)

Country Link
JP (1) JPS57133654A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0130279A2 (en) * 1983-03-25 1985-01-09 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JPH10335863A (en) * 1997-05-28 1998-12-18 Robert Bosch Gmbh Controller
US6949838B2 (en) 1998-10-01 2005-09-27 Micron Technology, Inc. Integrated circuit device
EP2055159A2 (en) * 2006-08-18 2009-05-06 Delphi Technologies Inc. Lightweight audio system for automotive applications and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114879A (en) * 1975-03-31 1976-10-08 Ibm Air cooled container actually mounted

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114879A (en) * 1975-03-31 1976-10-08 Ibm Air cooled container actually mounted

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0130279A2 (en) * 1983-03-25 1985-01-09 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JPH10335863A (en) * 1997-05-28 1998-12-18 Robert Bosch Gmbh Controller
US6949838B2 (en) 1998-10-01 2005-09-27 Micron Technology, Inc. Integrated circuit device
EP2055159A2 (en) * 2006-08-18 2009-05-06 Delphi Technologies Inc. Lightweight audio system for automotive applications and method
EP2055159A4 (en) * 2006-08-18 2010-12-01 Delphi Tech Inc Lightweight audio system for automotive applications and method

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