JPS57132445U - - Google Patents

Info

Publication number
JPS57132445U
JPS57132445U JP1919881U JP1919881U JPS57132445U JP S57132445 U JPS57132445 U JP S57132445U JP 1919881 U JP1919881 U JP 1919881U JP 1919881 U JP1919881 U JP 1919881U JP S57132445 U JPS57132445 U JP S57132445U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1919881U
Other languages
Japanese (ja)
Other versions
JPH0222987Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981019198U priority Critical patent/JPH0222987Y2/ja
Publication of JPS57132445U publication Critical patent/JPS57132445U/ja
Application granted granted Critical
Publication of JPH0222987Y2 publication Critical patent/JPH0222987Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1981019198U 1981-02-13 1981-02-13 Expired JPH0222987Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981019198U JPH0222987Y2 (enrdf_load_stackoverflow) 1981-02-13 1981-02-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981019198U JPH0222987Y2 (enrdf_load_stackoverflow) 1981-02-13 1981-02-13

Publications (2)

Publication Number Publication Date
JPS57132445U true JPS57132445U (enrdf_load_stackoverflow) 1982-08-18
JPH0222987Y2 JPH0222987Y2 (enrdf_load_stackoverflow) 1990-06-21

Family

ID=29817142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981019198U Expired JPH0222987Y2 (enrdf_load_stackoverflow) 1981-02-13 1981-02-13

Country Status (1)

Country Link
JP (1) JPH0222987Y2 (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53116082U (enrdf_load_stackoverflow) * 1977-02-24 1978-09-14
JPS5512747A (en) * 1978-07-12 1980-01-29 Matsushita Electronics Corp Lead frame detecting device
JPS5548140A (en) * 1978-10-03 1980-04-05 Oki Electric Ind Co Ltd Double feed senser of paper
JPS55163856A (en) * 1979-06-06 1980-12-20 Toshiba Corp Apparatus for positioning semiconductor device enclosure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53116082U (enrdf_load_stackoverflow) * 1977-02-24 1978-09-14
JPS5512747A (en) * 1978-07-12 1980-01-29 Matsushita Electronics Corp Lead frame detecting device
JPS5548140A (en) * 1978-10-03 1980-04-05 Oki Electric Ind Co Ltd Double feed senser of paper
JPS55163856A (en) * 1979-06-06 1980-12-20 Toshiba Corp Apparatus for positioning semiconductor device enclosure

Also Published As

Publication number Publication date
JPH0222987Y2 (enrdf_load_stackoverflow) 1990-06-21

Similar Documents

Publication Publication Date Title
FR2501305B1 (enrdf_load_stackoverflow)
FR2501665B1 (enrdf_load_stackoverflow)
FR2500161B1 (enrdf_load_stackoverflow)
CH655571B (enrdf_load_stackoverflow)
CH657106B (enrdf_load_stackoverflow)
FR2500748B1 (enrdf_load_stackoverflow)
FR2499331B1 (enrdf_load_stackoverflow)
FR2501579B1 (enrdf_load_stackoverflow)
FR2501769B1 (enrdf_load_stackoverflow)
FR2499718B1 (enrdf_load_stackoverflow)
FR2500959B1 (enrdf_load_stackoverflow)
FR2500143B1 (enrdf_load_stackoverflow)
FR2500434B1 (enrdf_load_stackoverflow)
FR2500251B1 (enrdf_load_stackoverflow)
FR2499294B1 (enrdf_load_stackoverflow)
CH655612B (enrdf_load_stackoverflow)
FR2498686B1 (enrdf_load_stackoverflow)
CH669300GA3 (enrdf_load_stackoverflow)
FR2500364B3 (enrdf_load_stackoverflow)
FR2499442B1 (enrdf_load_stackoverflow)
FR2498097B1 (enrdf_load_stackoverflow)
FR2498907B3 (enrdf_load_stackoverflow)
FR2499287B3 (enrdf_load_stackoverflow)
CH655610B (enrdf_load_stackoverflow)
FR2500276B3 (enrdf_load_stackoverflow)