JPS57131362A - Vacuum plating method and metal evaporating device - Google Patents
Vacuum plating method and metal evaporating deviceInfo
- Publication number
- JPS57131362A JPS57131362A JP1636181A JP1636181A JPS57131362A JP S57131362 A JPS57131362 A JP S57131362A JP 1636181 A JP1636181 A JP 1636181A JP 1636181 A JP1636181 A JP 1636181A JP S57131362 A JPS57131362 A JP S57131362A
- Authority
- JP
- Japan
- Prior art keywords
- crucible
- metal
- sleeve
- hole
- temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1636181A JPS57131362A (en) | 1981-02-06 | 1981-02-06 | Vacuum plating method and metal evaporating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1636181A JPS57131362A (en) | 1981-02-06 | 1981-02-06 | Vacuum plating method and metal evaporating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57131362A true JPS57131362A (en) | 1982-08-14 |
Family
ID=11914193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1636181A Pending JPS57131362A (en) | 1981-02-06 | 1981-02-06 | Vacuum plating method and metal evaporating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57131362A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5938382A (ja) * | 1982-08-26 | 1984-03-02 | Mitsubishi Heavy Ind Ltd | 真空蒸着装置 |
JPS6439369A (en) * | 1987-08-05 | 1989-02-09 | Mitsubishi Electric Corp | Vapor deposition method |
JP2004103269A (ja) * | 2002-09-05 | 2004-04-02 | Sanyo Electric Co Ltd | 有機el表示装置の製造方法 |
JP2004211110A (ja) * | 2002-12-26 | 2004-07-29 | Fuji Electric Holdings Co Ltd | 蒸着用るつぼ、蒸着装置および蒸着方法 |
JP2010121215A (ja) * | 2010-01-14 | 2010-06-03 | Semiconductor Energy Lab Co Ltd | 蒸着装置および蒸着方法 |
US7862855B2 (en) | 2005-01-06 | 2011-01-04 | Samsung Mobile Display Co., Ltd. | Controlling effusion cell of deposition system |
JP2011108386A (ja) * | 2009-11-13 | 2011-06-02 | Toshiba Corp | 真空バルブおよびその製造方法 |
-
1981
- 1981-02-06 JP JP1636181A patent/JPS57131362A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5938382A (ja) * | 1982-08-26 | 1984-03-02 | Mitsubishi Heavy Ind Ltd | 真空蒸着装置 |
JPS6160912B2 (ja) * | 1982-08-26 | 1986-12-23 | Mitsubishi Jukogyo Kk | |
JPS6439369A (en) * | 1987-08-05 | 1989-02-09 | Mitsubishi Electric Corp | Vapor deposition method |
JP2004103269A (ja) * | 2002-09-05 | 2004-04-02 | Sanyo Electric Co Ltd | 有機el表示装置の製造方法 |
JP2004211110A (ja) * | 2002-12-26 | 2004-07-29 | Fuji Electric Holdings Co Ltd | 蒸着用るつぼ、蒸着装置および蒸着方法 |
US7862855B2 (en) | 2005-01-06 | 2011-01-04 | Samsung Mobile Display Co., Ltd. | Controlling effusion cell of deposition system |
JP2011108386A (ja) * | 2009-11-13 | 2011-06-02 | Toshiba Corp | 真空バルブおよびその製造方法 |
JP2010121215A (ja) * | 2010-01-14 | 2010-06-03 | Semiconductor Energy Lab Co Ltd | 蒸着装置および蒸着方法 |
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