JPS57122557A - Inspecting device for lead bent of semiconductor device - Google Patents

Inspecting device for lead bent of semiconductor device

Info

Publication number
JPS57122557A
JPS57122557A JP863481A JP863481A JPS57122557A JP S57122557 A JPS57122557 A JP S57122557A JP 863481 A JP863481 A JP 863481A JP 863481 A JP863481 A JP 863481A JP S57122557 A JPS57122557 A JP S57122557A
Authority
JP
Japan
Prior art keywords
lead
inspecting
light
semiconductor device
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP863481A
Other languages
Japanese (ja)
Inventor
Kiminari Tajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIYUUSHIYUU NIPPON DENKI KK
NEC Kyushu Ltd
Original Assignee
KIYUUSHIYUU NIPPON DENKI KK
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIYUUSHIYUU NIPPON DENKI KK, NEC Kyushu Ltd filed Critical KIYUUSHIYUU NIPPON DENKI KK
Priority to JP863481A priority Critical patent/JPS57122557A/en
Publication of JPS57122557A publication Critical patent/JPS57122557A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce the size of an inspecting device, to simplify the device and to shorten the inspecting time of the device by moving a semiconductor device via a feeding mechanism, projecting a light to the end of a lead, photodetecting the light by a sensor, and judging the counted value of a counter. CONSTITUTION:A semiconductor device 1 is set on rails 8, is moved via a feeding mechanism, and the light from a light source 3 is projected via a reflecting mirror 4 to the end of the lead 2 of the device 1. The projected light is interrupted at every passage of the lead 2 (not bent) at the normal position, is received by a sensor 5, and is counted in number by a counter 6. This counted value is judged by a discriminator 7, thereby inspecting the presence or absence of the bent of the lead. In this manner, the bents of the lead can be inspected by a conveyor line with a small-size and simple device, thereby shortening the inspecting time.
JP863481A 1981-01-23 1981-01-23 Inspecting device for lead bent of semiconductor device Pending JPS57122557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP863481A JPS57122557A (en) 1981-01-23 1981-01-23 Inspecting device for lead bent of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP863481A JPS57122557A (en) 1981-01-23 1981-01-23 Inspecting device for lead bent of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57122557A true JPS57122557A (en) 1982-07-30

Family

ID=11698373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP863481A Pending JPS57122557A (en) 1981-01-23 1981-01-23 Inspecting device for lead bent of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57122557A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111001A (en) * 1982-12-16 1984-06-27 Matsushita Electric Ind Co Ltd Bending discriminator for lead of parts
JPS61279146A (en) * 1985-06-05 1986-12-09 Nhk Spring Co Ltd Defect detecting apparatus for pin piece of electronic part
JPS61279144A (en) * 1985-06-05 1986-12-09 Nhk Spring Co Ltd Defect detecting apparatus for pin piece of electronic part
JPS61279143A (en) * 1985-06-05 1986-12-09 Nhk Spring Co Ltd Defect detecting apparatus for pin piece of electronic part
JPS62145755A (en) * 1985-12-19 1987-06-29 Toshiba Corp Lead bend inspecting unit for semiconductor device
JP2011043263A (en) * 2009-08-19 2011-03-03 Mitsubishi Electric Corp Refrigerator

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111001A (en) * 1982-12-16 1984-06-27 Matsushita Electric Ind Co Ltd Bending discriminator for lead of parts
JPS61279146A (en) * 1985-06-05 1986-12-09 Nhk Spring Co Ltd Defect detecting apparatus for pin piece of electronic part
JPS61279144A (en) * 1985-06-05 1986-12-09 Nhk Spring Co Ltd Defect detecting apparatus for pin piece of electronic part
JPS61279143A (en) * 1985-06-05 1986-12-09 Nhk Spring Co Ltd Defect detecting apparatus for pin piece of electronic part
JPH0350417B2 (en) * 1985-06-05 1991-08-01 Nhk Spring Co Ltd
JPS62145755A (en) * 1985-12-19 1987-06-29 Toshiba Corp Lead bend inspecting unit for semiconductor device
JP2011043263A (en) * 2009-08-19 2011-03-03 Mitsubishi Electric Corp Refrigerator

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