JPS5710997A - Method and device for cooling printed board for automatic soldering device - Google Patents

Method and device for cooling printed board for automatic soldering device

Info

Publication number
JPS5710997A
JPS5710997A JP8516880A JP8516880A JPS5710997A JP S5710997 A JPS5710997 A JP S5710997A JP 8516880 A JP8516880 A JP 8516880A JP 8516880 A JP8516880 A JP 8516880A JP S5710997 A JPS5710997 A JP S5710997A
Authority
JP
Japan
Prior art keywords
printed board
automatic soldering
cooling printed
cooling
soldering device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8516880A
Other languages
Japanese (ja)
Inventor
Shin Okuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP8516880A priority Critical patent/JPS5710997A/en
Publication of JPS5710997A publication Critical patent/JPS5710997A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP8516880A 1980-06-25 1980-06-25 Method and device for cooling printed board for automatic soldering device Pending JPS5710997A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8516880A JPS5710997A (en) 1980-06-25 1980-06-25 Method and device for cooling printed board for automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8516880A JPS5710997A (en) 1980-06-25 1980-06-25 Method and device for cooling printed board for automatic soldering device

Publications (1)

Publication Number Publication Date
JPS5710997A true JPS5710997A (en) 1982-01-20

Family

ID=13851125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8516880A Pending JPS5710997A (en) 1980-06-25 1980-06-25 Method and device for cooling printed board for automatic soldering device

Country Status (1)

Country Link
JP (1) JPS5710997A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5973176A (en) * 1982-10-20 1984-04-25 Fujitsu General Ltd Soldering device
JPH0216260U (en) * 1988-07-08 1990-02-01

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5973176A (en) * 1982-10-20 1984-04-25 Fujitsu General Ltd Soldering device
JPS6235858B2 (en) * 1982-10-20 1987-08-04 Fujitsu General Ltd
JPH0216260U (en) * 1988-07-08 1990-02-01

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