JPH0216260U - - Google Patents

Info

Publication number
JPH0216260U
JPH0216260U JP9132788U JP9132788U JPH0216260U JP H0216260 U JPH0216260 U JP H0216260U JP 9132788 U JP9132788 U JP 9132788U JP 9132788 U JP9132788 U JP 9132788U JP H0216260 U JPH0216260 U JP H0216260U
Authority
JP
Japan
Prior art keywords
board
conveyor
fan
heating chamber
hot air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9132788U
Other languages
Japanese (ja)
Other versions
JPH0726048Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988091327U priority Critical patent/JPH0726048Y2/en
Publication of JPH0216260U publication Critical patent/JPH0216260U/ja
Application granted granted Critical
Publication of JPH0726048Y2 publication Critical patent/JPH0726048Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案の実施例を示すものであつて、第１
図は半田付装置の内部正面図、第２図及び第３図
は要部の正面図、第４図はコンベヤ上の基板の平
面図、第５図は他の実施例の要部正面図、第６図
ａ，ｂは更に他の実施例の要部正面図及び平面図
である。 １…コンベヤ、２…電子部品、３…基板、４…
加熱室、５…ヒータ、１０…ダンパー装置、１１
，１１ａ，１１ｂ…ダンパー。 The figure shows an embodiment of the present invention.
The figure is an internal front view of the soldering device, FIGS. 2 and 3 are front views of the main parts, FIG. 4 is a plan view of the board on the conveyor, and FIG. 5 is a front view of the main parts of another embodiment. FIGS. 6a and 6b are a front view and a plan view of main parts of still another embodiment. 1... Conveyor, 2... Electronic parts, 3... Board, 4...
heating chamber, 5... heater, 10... damper device, 11
, 11a, 11b... damper.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品が実装された基板を搬送するコンベヤ
と、このコンベヤの上方に配設された加熱室と、
この加熱室に配設された上記基板に熱風を吹き当
てるヒータ及びフアンとから成る半田付装置にお
いて、上記フアンの下方に可変ダンパー装置を配
設することにより、基板に吹き当てられる熱風の
風向きを変更自在としたことを特徴とする半田付
装置。 a conveyor that conveys a board on which electronic components are mounted; a heating chamber disposed above the conveyor;
In a soldering device consisting of a heater and a fan that blows hot air onto the board placed in the heating chamber, a variable damper device is installed below the fan to control the direction of the hot air blown onto the board. A soldering device characterized by being changeable.
JP1988091327U 1988-07-08 1988-07-08 Soldering device Expired - Lifetime JPH0726048Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988091327U JPH0726048Y2 (en) 1988-07-08 1988-07-08 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988091327U JPH0726048Y2 (en) 1988-07-08 1988-07-08 Soldering device

Publications (2)

Publication Number Publication Date
JPH0216260U true JPH0216260U (en) 1990-02-01
JPH0726048Y2 JPH0726048Y2 (en) 1995-06-14

Family

ID=31315811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988091327U Expired - Lifetime JPH0726048Y2 (en) 1988-07-08 1988-07-08 Soldering device

Country Status (1)

Country Link
JP (1) JPH0726048Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710997A (en) * 1980-06-25 1982-01-20 Senju Metal Industry Co Method and device for cooling printed board for automatic soldering device
JPS5883176U (en) * 1981-12-02 1983-06-06 株式会社日立製作所 Printed board paste solder dryer
JPS62159975U (en) * 1986-03-31 1987-10-12

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710997A (en) * 1980-06-25 1982-01-20 Senju Metal Industry Co Method and device for cooling printed board for automatic soldering device
JPS5883176U (en) * 1981-12-02 1983-06-06 株式会社日立製作所 Printed board paste solder dryer
JPS62159975U (en) * 1986-03-31 1987-10-12

Also Published As

Publication number Publication date
JPH0726048Y2 (en) 1995-06-14

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