JPS57109943A - Formation of submicron pattern using radiation sensitive resist - Google Patents
Formation of submicron pattern using radiation sensitive resistInfo
- Publication number
- JPS57109943A JPS57109943A JP55183996A JP18399680A JPS57109943A JP S57109943 A JPS57109943 A JP S57109943A JP 55183996 A JP55183996 A JP 55183996A JP 18399680 A JP18399680 A JP 18399680A JP S57109943 A JPS57109943 A JP S57109943A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- substrate
- radiation
- pattern
- radiation sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To finely work a substrate into a pattern of submicron order by using a radiation sensitive resist made of specified high molecular compound. CONSTITUTION:A polymer represented by the formula{where (m) and (n) are values adjusting the chloromethyl group content[m/(m+n)X100(%)]to >=30%} and having 5,000-60,000mol.wt. and <=1.5 dispersity (wt. average mol.wt./no. average mol.wt.) is used as a radiation senstivie resist. For example, the polymer is formed by chloromethylating poly-alpha-methylstyrene with low dispersity obtd. by living polymn. A film of said resist laid on a substrate to be worked is exposed to radiation and developed with a developer such as acetone or ketone-alcohol mixed soln. to form a resist pattern, and the substrate is patternwise worked using the patterned resist film as a protective mask.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55183996A JPS57109943A (en) | 1980-12-26 | 1980-12-26 | Formation of submicron pattern using radiation sensitive resist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55183996A JPS57109943A (en) | 1980-12-26 | 1980-12-26 | Formation of submicron pattern using radiation sensitive resist |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57109943A true JPS57109943A (en) | 1982-07-08 |
Family
ID=16145490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55183996A Pending JPS57109943A (en) | 1980-12-26 | 1980-12-26 | Formation of submicron pattern using radiation sensitive resist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57109943A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948759A (en) * | 1982-09-13 | 1984-03-21 | Kureha Chem Ind Co Ltd | Photoresist material |
US4515886A (en) * | 1983-02-16 | 1985-05-07 | Toyo Soda Manufacturing Co., Ltd. | Photosensitive compositions |
JPH01118507A (en) * | 1987-10-30 | 1989-05-11 | Nec Corp | Flatting material |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5074427A (en) * | 1973-10-23 | 1975-06-19 | ||
JPS54155826A (en) * | 1978-05-23 | 1979-12-08 | Western Electric Co | Method of producing radiation sensitive resist and product therefor |
JPS5511217A (en) * | 1978-07-10 | 1980-01-26 | Nippon Telegr & Teleph Corp <Ntt> | Pattern forming method using radiation sensitive high polymer |
JPS5582437A (en) * | 1978-12-15 | 1980-06-21 | Fujitsu Ltd | Method of making pattern |
-
1980
- 1980-12-26 JP JP55183996A patent/JPS57109943A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5074427A (en) * | 1973-10-23 | 1975-06-19 | ||
JPS54155826A (en) * | 1978-05-23 | 1979-12-08 | Western Electric Co | Method of producing radiation sensitive resist and product therefor |
JPS5511217A (en) * | 1978-07-10 | 1980-01-26 | Nippon Telegr & Teleph Corp <Ntt> | Pattern forming method using radiation sensitive high polymer |
JPS5582437A (en) * | 1978-12-15 | 1980-06-21 | Fujitsu Ltd | Method of making pattern |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948759A (en) * | 1982-09-13 | 1984-03-21 | Kureha Chem Ind Co Ltd | Photoresist material |
JPH0527106B2 (en) * | 1982-09-13 | 1993-04-20 | Kureha Chemical Ind Co Ltd | |
US4515886A (en) * | 1983-02-16 | 1985-05-07 | Toyo Soda Manufacturing Co., Ltd. | Photosensitive compositions |
JPH01118507A (en) * | 1987-10-30 | 1989-05-11 | Nec Corp | Flatting material |
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