JPS57107865A - Thermal printing head - Google Patents
Thermal printing headInfo
- Publication number
- JPS57107865A JPS57107865A JP55185852A JP18585280A JPS57107865A JP S57107865 A JPS57107865 A JP S57107865A JP 55185852 A JP55185852 A JP 55185852A JP 18585280 A JP18585280 A JP 18585280A JP S57107865 A JPS57107865 A JP S57107865A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- lead wires
- substrate
- printing head
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE:To make the printing head inexpensive without lowering the function thereof by connecting two circuit substrates by flexible wiring boards to form a matrix wiring. CONSTITUTION:Heating resistors 3 of mXn units are arranged on the surface of the first circuit substrate 2 and one end of each heating resistor 3 is connected to a diode array 4 on the substrate 2. The second circuit substrate 7 is a substrate of matrix wiring and the number of lead wires 8 is equal to n which is the number of the heating resistors per block. The flexible wiring board 9 is made to accord with the pitch of separate terminal electrodes 6 of the first circuit board 2 at the window 101 of the top terminals of concentric U-shaped lead wires 11 of n pieces, while at the window 102 thereof it is made to accord with the pitch of the lead wires 8 of the second circuit board 7. Then, m/2 units of these flexible wiring boards 9 are prepared and laid on the first and second circuit substrates 2 and 7 which are arranged on a base board 1 and bonded thereto. The lead wires of the window 102 and the lead wires 8 of the circuit substrate 7 are connected with each other, whrereby the printing head of an equivalent circuit is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55185852A JPS57107865A (en) | 1980-12-26 | 1980-12-26 | Thermal printing head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55185852A JPS57107865A (en) | 1980-12-26 | 1980-12-26 | Thermal printing head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57107865A true JPS57107865A (en) | 1982-07-05 |
Family
ID=16178000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55185852A Pending JPS57107865A (en) | 1980-12-26 | 1980-12-26 | Thermal printing head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57107865A (en) |
-
1980
- 1980-12-26 JP JP55185852A patent/JPS57107865A/en active Pending
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