JPS57106135A - Pellet bonder - Google Patents

Pellet bonder

Info

Publication number
JPS57106135A
JPS57106135A JP55181996A JP18199680A JPS57106135A JP S57106135 A JPS57106135 A JP S57106135A JP 55181996 A JP55181996 A JP 55181996A JP 18199680 A JP18199680 A JP 18199680A JP S57106135 A JPS57106135 A JP S57106135A
Authority
JP
Japan
Prior art keywords
piece
shaft
scrub
center
drive unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55181996A
Other languages
English (en)
Japanese (ja)
Other versions
JPS637460B2 (cg-RX-API-DMAC7.html
Inventor
Osamu Sumiya
Tsutomu Mimata
Kaoru Ito
Tatsuo Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55181996A priority Critical patent/JPS57106135A/ja
Publication of JPS57106135A publication Critical patent/JPS57106135A/ja
Publication of JPS637460B2 publication Critical patent/JPS637460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP55181996A 1980-12-24 1980-12-24 Pellet bonder Granted JPS57106135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55181996A JPS57106135A (en) 1980-12-24 1980-12-24 Pellet bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55181996A JPS57106135A (en) 1980-12-24 1980-12-24 Pellet bonder

Publications (2)

Publication Number Publication Date
JPS57106135A true JPS57106135A (en) 1982-07-01
JPS637460B2 JPS637460B2 (cg-RX-API-DMAC7.html) 1988-02-17

Family

ID=16110494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55181996A Granted JPS57106135A (en) 1980-12-24 1980-12-24 Pellet bonder

Country Status (1)

Country Link
JP (1) JPS57106135A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130537A (ja) * 1987-11-17 1989-05-23 Nec Corp ダイボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130537A (ja) * 1987-11-17 1989-05-23 Nec Corp ダイボンディング装置

Also Published As

Publication number Publication date
JPS637460B2 (cg-RX-API-DMAC7.html) 1988-02-17

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