JPS57102137U - - Google Patents
Info
- Publication number
- JPS57102137U JPS57102137U JP1980178410U JP17841080U JPS57102137U JP S57102137 U JPS57102137 U JP S57102137U JP 1980178410 U JP1980178410 U JP 1980178410U JP 17841080 U JP17841080 U JP 17841080U JP S57102137 U JPS57102137 U JP S57102137U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980178410U JPS57102137U (https=) | 1980-12-12 | 1980-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980178410U JPS57102137U (https=) | 1980-12-12 | 1980-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57102137U true JPS57102137U (https=) | 1982-06-23 |
Family
ID=29973178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980178410U Pending JPS57102137U (https=) | 1980-12-12 | 1980-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57102137U (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
| JPS63110034U (https=) * | 1987-01-09 | 1988-07-15 | ||
| JPS63249341A (ja) * | 1987-04-06 | 1988-10-17 | Tomoegawa Paper Co Ltd | 半導体装置 |
| JPS63249342A (ja) * | 1987-04-06 | 1988-10-17 | Tomoegawa Paper Co Ltd | 半導体装置 |
-
1980
- 1980-12-12 JP JP1980178410U patent/JPS57102137U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
| JPS63110034U (https=) * | 1987-01-09 | 1988-07-15 | ||
| JPS63249341A (ja) * | 1987-04-06 | 1988-10-17 | Tomoegawa Paper Co Ltd | 半導体装置 |
| JPS63249342A (ja) * | 1987-04-06 | 1988-10-17 | Tomoegawa Paper Co Ltd | 半導体装置 |