JPS5698894A - Method of manufacturing key contact printed circuit board with copper foil land - Google Patents
Method of manufacturing key contact printed circuit board with copper foil landInfo
- Publication number
- JPS5698894A JPS5698894A JP80180A JP80180A JPS5698894A JP S5698894 A JPS5698894 A JP S5698894A JP 80180 A JP80180 A JP 80180A JP 80180 A JP80180 A JP 80180A JP S5698894 A JPS5698894 A JP S5698894A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- key contact
- contact printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55000801A JPS5821838B2 (en) | 1980-01-08 | 1980-01-08 | Manufacturing method of key contact printed circuit board with copper foil land |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55000801A JPS5821838B2 (en) | 1980-01-08 | 1980-01-08 | Manufacturing method of key contact printed circuit board with copper foil land |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5698894A true JPS5698894A (en) | 1981-08-08 |
JPS5821838B2 JPS5821838B2 (en) | 1983-05-04 |
Family
ID=11483781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55000801A Expired JPS5821838B2 (en) | 1980-01-08 | 1980-01-08 | Manufacturing method of key contact printed circuit board with copper foil land |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5821838B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60100003A (en) * | 1983-08-25 | 1985-06-03 | Hitachi Cable Ltd | Monitoring system of abnormality of substance embedded in ground |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5548996A (en) * | 1978-10-05 | 1980-04-08 | Alps Electric Co Ltd | Circuit board |
-
1980
- 1980-01-08 JP JP55000801A patent/JPS5821838B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5548996A (en) * | 1978-10-05 | 1980-04-08 | Alps Electric Co Ltd | Circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS5821838B2 (en) | 1983-05-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56155592A (en) | Copper foil for printed circuit and method of manufacturing same | |
JPS56153797A (en) | Method of manufacturing multilayer printed circuit board substrate | |
JPS56122194A (en) | Method of manufacturing printed circuit board | |
JPS56116697A (en) | Method of forming conductor layer on multilayer circuit board | |
JPS5673495A (en) | Method of fabricating printed circuit board with contact | |
JPS5698894A (en) | Method of manufacturing key contact printed circuit board with copper foil land | |
JPS56100494A (en) | Method of manufacturing printed circuit board | |
JPS56157089A (en) | Method of manufacturing printed circuit board | |
JPS571296A (en) | Method of manufacturing multilayer printed circuit board | |
JPS56118396A (en) | Method of forming conductive layer of circuit board | |
JPS56118397A (en) | Method of forming conductive layer of circuit board | |
JPS575397A (en) | Method of manufacturing printed circuit board | |
JPS56157091A (en) | Method of manufacturing printed circuit board | |
JPS5772396A (en) | Method of fabricating printed circuit board | |
JPS5678193A (en) | Method of fabricating printed circuit board | |
JPS56112797A (en) | Method of manufacturing through hole printed circuit board | |
JPS571297A (en) | Method of manufacturing multilayer printed circuit board | |
JPS56105693A (en) | Method of manufacturing multilayer printed circuit board | |
JPS56124297A (en) | Method of manufacturing multilayer printed circuit board | |
JPS5775492A (en) | Method of fabricating printed circuit board | |
JPS56153796A (en) | Method of manufacturing multilayer printed circuit board substrate | |
JPS5792896A (en) | Multilayer printed circuit board with conductor in inner layer | |
JPS5697923A (en) | Method of coating key contact copper foil for printed circuit board | |
JPS56100490A (en) | Method of manufacturing printed circuit board | |
JPS56107593A (en) | Method of manufacturing printed circuit board |